Throughput in placement more than six-fold – Growth consistently above industry average despite procurement crisis
Kelsterbach, July 25th, 2022 – With the installation of a new production line, EMS service provider Baudisch Electronicwww.baudisch-electronic.de) has raised its SMD production to a new level. The company was experiencing a steady increase in order volume and production was reaching its capacity limits with the previous isolated solution. Baudisch Electronic therefore decided to install an SMD line and realized this with FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) as general contractor. The throughput of the placement line is six times higher than with the previous solution. Quality and flexibility have been significantly increased by the new line solution.
As a full-service EMS provider with an EMC laboratory, Baudisch specializes in the production of prototypes as well as small and large series. The requirements in this environment are continuously increasing. Individualization, flexibility and speed determine production. For this reason, the new SMD line had to feature a high degree of automation and be capable of placing particularly small components such as 0201 (“008004”) as well as the greatest possible flexibility for odd-form parts up to 74 x 74 mm. Short setup times and lean production were further goals.
Performance improvement all along the line
Today’s SMD line features a transport system, laser, stencil printer, 3D SPI, SMD placement machine, reflow oven and storage system. The six modules of the NXT III placement platform from FUJI EUROPE CORPORATION GmbH form the core. FUJI is a manufacturer of highly flexible placement systems ranging from high-mix/low-volume to complete placement lines in the high-volume market. The company was the general contractor in the project and coordinated all parties involved.
“We have been able to decisively expand our range of services by using the new placement solutions. Our company now handles 01005 components, for example. We can also serve the high-volume sector today. As a result, we address a larger target group and have been able to acquire new customers,” explains Matthias Lenz, Managing Director of Baudisch Electronic GmbH.
At the same time, Baudisch Electronic has increased the placement performance many times in comparison to the previous system. Matthias Lenz sums up: “Already one week after the launch of the new SMD line, the first successes became visible. The output increased from 12,000 BT/h to currently 77,000 BT/h – at a better quality. The higher placement quality also significantly reduced the amount of rework required, and the automatic storage system led to shorter setup times.”
The even more consistent and better product quality results, among other things, from the implementation of the fully automatic SPI system for solder paste inspection, in-line marking by laser and the high-end assembly machines offered by FUJI. At the same time, a new traceability system has been adapted and there is complete traceability of all manufactured products.
Despite crises in the market: constant growth since acquisition of the SMD line
“Since 2020, we have been subject to major challenges due to the Corona pandemic as well as the raw material, energy and chip crises. Nevertheless, Baudisch Electronic’s growth has been consistently above the industry average since the acquisition of the SMD line. This is certainly due to our improved performance. Shorter delivery times, the highest product quality, and a flexible response to changes in orders at short notice – these are arguments that our customers appreciate all the more in these difficult times,” says Matthias Lenz.
/wp-content/uploads/2022/07/Baudisch-Electronic_Von-der-Inselloesung-zur-SMD-Linie-mit-FUJI.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-07-25 11:28:542022-07-25 11:29:42From stand-alone solution to SMD line with FUJI – Baudisch Electronic draws a positive conclusion
Electronics systems supplier expands product portfolio in Austrian and neighbouring markets with highly flexible FUJI placement solutions
Kelsterbach, July 4th, 2022 – FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) and Stepan GmbH will cooperate in the future. The focus of this strategic partnership is, among other things, to strengthen the market presence of FUJI and its SMT placement solutions – especially in Austria and its neighbouring countries. This will result from the sales support provided by the Austrian electronics system supplier Stepan. FUJI users and interested parties are thus offered the best possible support, short response times and very high consulting quality.
FUJI EUROPE CORPORATION GmbH is a specialist for highly flexible placement systems in the high-mix/low-volume up to complete placement lines in the high-volume market. Stepan GmbH specializes in highly flexible solutions for the electronics industry. The electronics system supplier for SMT and THT production offers, among other things, high-tech machines and materials for the entire field of the electronics industry.
“We are represented by subsidiaries and sales partners in numerous countries around the world. We have been directly active in Austria for several years. Through the cooperation with Stepan GmbH, we will further increase our market coverage, especially in Austria and its neighbouring Eastern European countries. Our new partner has been active in the business of printed circuit boards, coilware and electronics production for more than 30 years and will give us access to the Austrian market, to companies from sectors such as automotive, industrial, EMS and mobile devices. I The existing market presence of Stepan GmbH, also in the neighbouring countries, creates synergy effects and thus a high market potential”, says Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH.
In the course of the partnership, Stepan GmbH benefits from FUJI’s wide product portfolio and its increasing focus on Industry 4.0 and automation. Stefan Kessler, Managing Director of Stepan GmbH, says: “Electronics production is increasingly characterized by a variable combination of high placement performance and a versatile product mix with small batch sizes. Short changeover times and flexibility as well as more and more automated processes are essential requirements. FUJI’s placement solutions are designed to meet these requirements and increasingly focus on automation, thus fulfilling the demands of modern industry. They therefore fit ideally into our range of services.”
/wp-content/uploads/2022/07/Strategische-Zusammenarbeit-zwischen-FUJI-EUROPE-CORPORATION-GmbH-und-Stepan-GmbH.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-07-04 09:00:002022-07-04 10:06:16Strategic cooperation between FUJI EUROPE CORPORATION GmbH and Stepan GmbH
EMS service provider expands capacities in SMD placement
Kelsterbach, June 23rd, 2022 – EMS service provider Avex electronics s.r.o. is expanding its capacities in SMD placement and thus strengthening its market position. To this end, the company has installed additional placement machine of AIMEXIII and AIMEXIIIc series from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de/en). The new SMT line will massively increase the existing placement capacity. It also sets new milestones in terms of flexibility, precision and quality. In addition, a new Smart Nozzle Cleaner from FUJI ensures reliable maintenance processes, smooth operation and high placement quality.
Avex electronics s.r.o. whose headquarters are in Slovakia, specializes, among other things, in the assembly of printed circuit boards (SMT and THT) with full traceability and the development of test equipment. The company serves the consumer goods, automotive and lighting industries.
Karol Gočal, Marketing and Sales Manager at Avex electronics s.r.o., explains: “We manufacture very high volumes in mass production as well as small series, prototypes and test series. Demand is currently very high. In order to expand our capacities, we have commissioned a new SMT line. We decided to use FUJI placement machines, as they are designed for high-mix production.”
The AIMEXIII/IIIc automatic placement machine is a machine platform that allows any type of production and changes in the used package shapes. It supports in one machine the processing of the smallest (0201 mm) chip components up to large components (32 x 1180 mm). This makes it easy to ramp up new production or respond to changes in package shapes. Glue dots can also be easily applied with the DX placement head via the Glue Tool in the dispensing process.
Both platforms are highly flexible and expandable. For example, the placement heads can be changed or adapted to an optimum machine configuration in just a few minutes without tools. All placement heads used are additionally equipped with the “Intelligent Parts Sensor” (IPS). This ensures seamless monitoring from pickup of the components to placement. The DX heads are highly flexible and change tools fully automatically from dispensing tasks to mechanical gripping tools for odd-shaped components to chip shooter tasks.
More efficient processes and more freedom of action
“The FUJI placement machines increase precision, quality and reliability and give us more freedom of action. We are therefore planning to integrate further placement machines from the AIMEX series into our production,” explains Karol Gočal.
At the same time, Avex also attaches importance to higher efficiency through automated processes – including maintenance. Therefore, the company uses the Smart Nozzle Cleaner, which enables documented cleaning, storage, and preparation for the next set-up. The system is integrated into FUJI’s NEXIM operating software. In this way, all cleaned nozzles are monitored via quality management and Avex successfully implements a “zero defect strategy”.
“In order to keep the availability in production efficient and high, the maintenance of the equipment for a stable and high quality is of crucial importance. The Smart Nozzle Cleaner from FUJI ensures regular cleaning of the nozzles and thus ensures the highest placement quality. Furthermore, in addition to cleaning, a complete quality control of the nozzles is carried out. In this way, it is ensured that only inspected nozzles are used for production. All this reduces errors, saves manual interventions and thus costs,” says Jonas Ernst, Assistant Managing Director and Export Sales Manager at FUJI EUROPE CORPORATION GmbH.
Avex electronics s.r.o. was acquired as a customer through the FUJI agent AMTECH, spol. s r.o.. This proves the successful cooperation between FUJI Europe and the sales network in the respective local market.
/wp-content/uploads/2022/06/Avex-electronics-sro-installiert-neue-SMT-Linie-mit-Bestueckungsautomaten-von-FUJI.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-06-23 08:00:352022-06-22 14:57:36Avex electronics s.r.o. installs new SMT line with automatic placement machines from FUJI
Specialist for electronic placement machines announces new Branch Manager UK & Ireland and new Area Sales Manager UK & Ireland
Kelsterbach, May 2d, 2022 – Many manufacturing companies, including those in the United Kingdom (UK) and Ireland, are moving towards producing PCBs they need for their production in-house. The European sales headoffice FUJI EUROPE CORPORATION GmbH, which sells own branded SMD placement machines for placement of various electrical and electronic components, is further expanding its activities in both European and UK markets. Martin Rennie is announced as the new Branch Manager UK & Ireland and Artur Tobolski as the new Area Sales Manager UK & Ireland.
“In the past, many customers had moved their production abroad due to lower labour costs and infrastructure. Now we are noticing a change. Partly due to the ongoing supply shortages and the resulting shortage of materials, more and more FUJI customers are currently shifting their focus towards in-house PCB production – most notably in the market of UK and Ireland. This is especially true for medical products, which represent a major growth area in global electronics,” explains Martin Rennie, Branch Manager UK & Ireland at FUJI EUROPE CORPORATION GmbH.
FUJI is therefore expanding its activities in the UK and Ireland and supporting manufacturing companies, for example, in setting up their own production lines. Martin Rennie is playing a key role in advancing this goal. A highly experienced engineer, he had worked for a Fuji customer as a SMD engineer before joining Fuji in 1999 as a service engineer. Before this step up to the Branch Manager role Martin Rennie had risen to senior field service engineer within Fuji.
Artur Tobolski, Area Sales Manager UK & Ireland at FUJI, recently joined the company and has set his goals high. Artur Tobolski is delighted to be part of the team and explains, “We are currently expanding structures and activities in many of our branches. We want to increase market share in the UK and Ireland by providing appropriate service and technical advice so that local manufacturing companies can set themselves up for the new challenges ahead.” Artur Tobolski has 19 years of experience in management positions in the SMT sector. He is an experienced manufacturing engineer with extensive knowledge of Fuji platforms from both hardware and software side.
FUJI EUROPE CORPORATION covers all areas of modern production in Europe: from highly flexible placement systems in high-mix to complete placement lines in high-volume. By providing the machines and supporting services, many manufacturing companies no longer need to procure from external EMS service providers. This means that the production flow is increased and possible supply shortages in times of crisis are prevented.
/wp-content/uploads/2022/05/Fuji_UK_Tobolski_Rennie.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-05-02 09:15:002022-05-10 13:04:37FUJI EUROPE CORPORATION expands activities in UK and Ireland
Automation and sensor technology specialist implements condition-based maintenance using shop-floor integration
Kelsterbach, March 25, 2022 – The sensor manufacturer ifm electronic gmbh relies on placement machines from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) for the production of IO-Link sensors for Industry 4.0. The company is using 14 scalable pick-and-place platforms of the NXT III series for the production of the printed circuit board. They support the smallest parts used in mass production and offer extreme positioning accuracy. Furthermore, they are suitable for condition-based maintenance. For this, ifm uses the GIB shop-floor integration, which is based on real data and records the individual abrasion of tools.
Sensors with IO-Link interface are predestined for requirements in the networked factory. They enable transparency regarding machine data. The sensors feature digital and therefore interference-free transmission of the measured values. In addition, they provide further information to higher-level systems, enabling them to be used for predictive maintenance, for example. They can be used in a variety of ways in production plants and are easy to install.
ifm electronic gmbh offers such intelligent sensors. Founded in 1969, the company develops, produces and sells sensors, controll systems, software and systems for industrial automation worldwide. The group has around 8,100 employees all over the world and serves sectors such as the automotive, food and packaging industries. Machine tool manufacturers are also among its customer base.
The most important element of an IO-Link sensor is a printed circuit board which enables the communication. Stefan Gessler, head of the maintenance department at ifm, explains: “For the production of the PCBs, we rely on SMD placement machines from FUJI. We are using 14 modules of the NXT III series in our production. They achieve extreme positioning accuracy. The placement heads can also be easily replaced without tools. This enables offline maintenance, i.e. without interrupting ongoing production.”
The FUJI machines represent the basis for the condition-based maintenance of the placement heads introduced at ifm. This was realized by the Shop-Floor-Integration of the software manufacturer GIB. The sensors in the machine measure the placement cycles of the respective head and automatically forward the data to the ERP system. When the maximum number of picks per placement head is reached, the system independently creates a maintenance order and initiates the spare parts provision. ifm can thus carry out more efficient and plannable maintenance and servicing. Downtimes and set-up times are minimized.
/wp-content/uploads/2022/03/Fuji-L7_3_web.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-03-28 09:19:302022-04-08 11:22:59ifm produces sensors for Industry 4.0 with assembly solutions from FUJI
Kelsterbach, March 18th, 2022 – Klaus Gross, Managing Director of FUJI EUROPE CORPORATION, is taking his well-deserved retirement on March 31 and will leave the company after 30 years. On April 1, Mr. Stefan Janssen, until now Ass. Managing Director, will succeed him. The long-term corporate goals, first and foremost “Total Customer Satisfaction” – highest customer satisfaction and service – as well as healthy growth and reliability will remain in focus.
30 years ago, Klaus Gross changed from the customer side, then Motorola, to the supplier side in the still freshly founded subsidiary of FUJI. Since then, he has accompanied and guided the company in various positions up to the present day.
Great gratitude
“I would like to take this opportunity to sincerely thank our customers for their loyalty, faithfulness and extraordinary good cooperation over all these years. Furthermore, I would like to thank our partner companies who have supported us in our success over many years. I would also like to express my warmest thanks to my employees and colleagues. Their hard work and motivation have brought us to where we are today. Just as important is and was the global team spirit with the different cultures in Japan and all other FUJI subsidiaries worldwide. It is a tightly woven network, indeed you could say a multicultural family with a very large feel-good factor and very pleasant and effective communication,” explains Klaus Gross.
Ideal management position
FUJI stands for mastering customer requirements with technically revolutionary solutions, leading quality and outstanding service. “Against this background, Stefan Janssen is the ideal person to lead FUJI EUROPE,” explains Gross. “His many years of experience in international key accounts for automotive customers, as well as being the second man on the management board, will resolutely help us to successfully pursue our strategic goals in the long term,” says Klaus Gross.
Generation change
In place of the Ass. Managing Director is Mr. Jonas Ernst, who has already been with FUJI EUROPE CORPORATION GmbH since 2012 – recently as Export Sales Manager. “With the choice for Jonas Ernst, we will make a generational change, which will certainly blow a fresh wind into our structures, and will also position FUJI securely for the future,” says Klaus Gross.
Farewell to life’s work
After more than a Quarter Century, Mr. Gross’ farewell is not only a milestone for FUJI, but also for Gross himself. “The company has been an important part of my life,” he says, looking back on the last few years. “Letting go now is not easy. And yet I’m also looking forward to the new stage in my life, where many other things are waiting for me.” Gross will leave FUJI on March 31, 2022.
/wp-content/uploads/2022/03/Geschaeftsfuehrerwechsel_S_Janssen_K_Gross_J_Ernst.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-03-24 16:18:372022-04-08 11:23:14Milestone at FUJI EUROPE CORPORATION: Change of Managing Director after 30 years of service
FUJI placement systems enhance transparent and automated production – new: fiducial mark camera for inspection of placed parts
Kelsterbach, March 17, 2022 – FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) (www.fuji-euro.de) will demonstrate various placement solutions for the requirements of increasingly digitalized factories at the “SMTconnect 2022” trade fair from May 10th to 12th in Nuremberg. At Booth 5-430 in Hall 5, the company will be showing, among other things, labor-saving and quality-assuring solutions for assembly processes in smart factories. The goals are: zero placement errors, zero machine stops, autonomous and automatic operation. Visitors will also be able to find out about a new feature of the NXTR smart factory platform: the possibility of inspecting placed parts with a fiducial mark camera.
Solutions for automated, efficient processes – especially for repeated tasks – are key elements in Industry 4.0. FUJI EUROPE CORPORATION GmbH, an internationally active specialist for electronics placement machines, offers various solutions for this purpose, such as the NXTR smart factory platform, which is used for step-by-step automation and digitalization.
The NXTR aims at optimizing production preparation and maintenance processes as well as automating manual placement assembly processes for comprehensive networking and self-optimized production. The NXTR placement solution helps operators free themselves from repetitive tasks – while maximizing quality and productivity. FUJI follows the “3 Zero” strategy: zero placement errors, zero machine operators, zero machine stops. In this way, repetitive processes can be automated with just a few resources and the path to Industry 4.0 can be paved.
Reduce errors and improve traceability with fiducial mark camera
The NXTR “Smart Factory” platform from FUJI has many unique selling points. One of them – and new in the scope of functions – is the possible inspection of the placed parts with a fiducial mark camera. This makes it possible to check the existence, position and polarity of the parts. This feature can reduce the occurrence of defective panels. In addition, traceability can be improved as all images and results are stored after inspection. Industry-wide, this feature is unique to FUJI’s NXTR.
“Solutions for labor saving in production preparation and maintenance processes as well as for automating manual placement assembly processes have become indispensable. For many years, we have therefore already been developing various labor-saving units that provide support in setting up and maintaining a smart factory. The NXTR is predestined for this purpose,” explains Stefan Janssen, General Manager of FUJI EUROPE CORPORATION GmbH, and continues, “In addition, we will be demonstrating further placement solutions at SMTconnect that support the tasks in the industry. We are pleased to be able to meet interested parties again at a trade show and show them examples of how smart manufacturing can work.”
/wp-content/uploads/2022/03/NXTR_MPI.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-03-18 15:27:412022-03-18 15:29:20FUJI EUROPE CORPORATION will be exhibiting at the SMTconnect placement solutions for modern industry
The first printed circuit board produced in the Schubert System Elektronik plant in Neuhausen ob Eck
Electronics manufacturer produces printed circuit boards in-house for the first time with support from FUJI and minimizes dependence on EMS service providers
Kelsterbach, February 3, 2022 – Schubert System Elektronik GmbH has implemented a line concept for the independent production of printed circuit boards. Until now, these had been supplied by EMS service providers. The new production line was necessary to counter ongoing supply shortages in the procurement of printed circuit boards, but also to be independent for strategically important in-house developments. Production has already started successfully. The integrated line concept comes from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) and enables Schubert System Elektronik to carry out prototyping as well as the production of medium series sizes.
Schubert System Elektronik GmbH, headquartered in Neuhausen ob Eck, offers solutions for the Industry 4.0 environment. The company has more than 50 years of development and application experience in the field of industrial computer systems. The portfolio includes sensor and monitoring systems as well as modular computer products and systems. The portfolio includes individual products for numerous industrial fields, such as mechanical engineering as well as food and medical technology.
Supply shortages of printed circuit boards disrupted production flow
For the production of its products and systems, Schubert System Elektronik depends, among other things, on the purchase of printed circuit boards, but this has proved increasingly problematic in the recent past.
Javier Aller Fuentes, Head of Production at Schubert System Elektronik GmbH, explains: “Up to now, we have had the PCBs required for our own production supplied by EMS service providers. However, purchasing from Asia in particular has been very difficult since the beginning of the pandemic. Due to the ongoing supply shortages and the resulting shortage of materials, we decided to produce some of our printed circuit boards from now on by ourselves. As a result, we contracted FUJI EUROPE CORPORATION as general contractor to set up a production line for this purpose.” Further reasons for the installation are the increase of the production depth as well as the additionally gained flexibility to react to customer requirements.
FUJI realizes complete production line
For the production line, FUJI supplied all the necessary components such as loader, printer, SPI, pick-and-place, oven, AOI, warehousing and washing. Consideration is given to hardware and software from FUJI as well as products from other manufacturers.
Jochen Krisch, Area Sales Manager at FUJI EUROPE CORPORATION GmbH, says: “Towards the end of 2021, we carried out the line construction, which consisted of delivery and installation. The line was then in service a few weeks later. The official line acceptance will take place in the next few days. However, the first printed circuit boards have already been successfully produced. This shows that the production of the printed circuit boards is running smoothly.”
Great flexibility in the high-mix range
For the production line, among other things, the sItower Various 930 is used as production supply storage for up to 1,300 SMD electronic component reels as well as two FUJI AIMEX III c with DynaHead. The AIMEX III c placement machine increases flexibility in the high-mix area and is designed for modern setup concepts such as batch changeover, fixed setup and AB mode.
“Our AIMEX III c enables prototyping up to the production of medium series sizes. The system can be equipped with different placement heads in just a few seconds, which further increases the machine’s capacity and enables optimal alignment with the respective product to be manufactured,” explains Jochen Krisch.
With the production line for printed circuit boards designed and installed by FUJI, Schubert System Elektronik has positioned itself as independent and future-oriented. It is no longer necessary to procure printed circuit boards from external EMS service providers, which increases the production flow and helps to avoid possible supply shortages in times of crisis.
/wp-content/uploads/2022/02/FUJI_Schubert-System-Elektronik.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-02-03 11:37:112022-02-03 11:37:28FUJI EUROPE implements the complete production line for printed circuit boards at Schubert System Elektronik GmbH
On behalf of our entire FUJI team, we would like to start the year by expressing our warmest thanks to all FUJI fans. We have big plans to build on the successes we had from previous years and revolutionize placement technology. Will you accompany us in this? We are looking forward to exciting projects together!
With best wishes for the new year, your management team of FUJI EUROPE CORPORATION GmbH
f.l.t.r. Stefan Janssen, Klaus Gross, Kikuo Kondo
/wp-content/uploads/2022/01/FUJI_Neujahrsgruesse.jpg10001500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2022-01-14 15:31:332022-01-14 15:53:27We have big plans to build on the successes we had from previous years and revolutionize placement technology
The worldwide spread of the COVID-19 has had a major impact on political, economic, and social activities, and has forced a rapid transformation of lifestyles. The COVID-19 era is changing workstyles with the rapid spread of teleworking from home and online meetings. In the past, robots were expected to improve the efficiency of business operations and to compensate for the shortage of workers due to the declining birthrate and aging population, but they are now finding new value in various industrial fields as service robots to realize “remote,” “non-contact,” and “non-face-to-face” operation that reduces the risk of infection. In addition, in order to curb the spread of infections and raise alarms, you may have heard about human contact data based on location information of communication terminals in the news. There is an awareness of the importance of how to go about utilizing the data already present in the field in both software and hardware applications.
We would like to demonstrate our vision of a future society which is an age of linking people, things, data, and processes (figure 1). In the “age of linking people, things, data, and processes”, information that can be difficult to grasp, such as information related to behavior, including food, clothing, housing, health, purchasing, and transportation, and information related to the environment, such as climate and traffic, and information related to the business and operations of companies, will be digitized and centrally managed by connecting to a network, thus creating new value. While what we do here at Fuji is only a drop in the ocean compared to what is happening across society as a whole, we are keeping ahead of the curve. In this article we will cover the placement technology trends for 2021 and then introduce our efforts for digital twin solutions.
Figure 1: Future society an age of linking people, things, data, and processes
2. Placement market technology trends for 2021
2.1 SMT part trends
The number of placements on boards continues to increase due to the increasing number of multifunctional and high-performance communication devices such as smartphones and smartwatches, the expansion of network infrastructure and sensor devices with the spread of 5G and IoE, and the spread of electric vehicles. This section shows the size trend for SMT parts and the trend for semiconductor packages.
According to the 2019 mounting technology roadmap (JEITA Electronic Technology Industry Association), the composition ratio of multilayer ceramic capacitors reached the crosspoint between 0603 (0201″) and 1005 (0402″) in 2018, with the composition ratio of 0603 (0201″) being the highest. Smartphones require compact placement areas and three dimensional placements in order to have more functions and maintain battery area. As a result, the proportion of 0402 (01005″) parts is expected to grow in the future and reach around 20% by 2025. 0201 mm (008004″) parts are also expected to see increased usage through 2022. In addition to the miniaturization of passive parts, the gap between adjacent parts is also becoming narrower every year and it is expected to reach around 50 microns by 2024. When placing parts onto panels with fine pitches between parts, there are cases in which the tip of the nozzle may come in contact with an already placed part if the nozzle tip protrudes from the edge of the held part, leading to placement defects. In such cases, optimal nozzle design and nozzle selection are important. In the future, placement quality will need to be more strictly controlled, but we will continue to develop placement machines that are both faster and more accurate while ensuring quality so that users can mount their products with peace of mind.
Next, we will cover semiconductor package trends. Semiconductor packages are becoming thinner and narrower from the demand for more pins, and they are shifting from large QFPs (Quad Flat Package) to BGAs (Ball Grid Array), and from small QFPs to QFNs (Quad Flat No-leads) and WLPs (Wafer Level Package). On the other hand, there is a demand for large and heavy BGAs for server products, and the NXT modular placement machine currently supports sizes up to 102 x 102 mm for standard specifications and up to 150 x 150 mm with custom specifications. Although there is a common trend toward more pins for the higher performance of equipment, the size and weight characteristics differ depending on the application.
2.2 Semiconductor placement solutions
A common theme in the production processes for SiP (System in Package) and module parts is the intertwining of cutting-edge placement technologies such as those for higher density placements, thinner structures, and multilayering. Figure 2 shows some of Fuji’s solutions for producing SiP and other module parts. In addition to the figure below, as panels become thinner, it is necessary to be able to retain panels while correcting the deflection of the panel and keeping the height of the panel placement surface at a uniform height so that placement quality can be kept stable. In line with this, vacuum backup is effective for retaining thin panels. Vacuum backup uses vacuum pressure to retain thin panels on the upper surface of a vacuum plate to ensure that the part placement surface is at a uniform height. Vacuum backup also helps to reduce the impact of panel warpage and vibrations on the panel from the load to a minimal amount when parts are placed.
Figure 2: Fuji’s solutions for producing SiP and other module parts
3. Smart factory evolution with digital twin
3.1 Digital connections with SMT lines
By using digital twin technology with smart factories, SMT lines are becoming more automated and digitalized. Digital twins are constructions of real world environments in a virtual world, to simulate those environments in the virtual space, and to predict and control what may happen in the real world in advance. We create proposals that incorporate digital Twins because we envision cases in which peripheral equipment such as AGVs are operated in concert with our pick and place machine, the NXTR (figure 3). This section explains our initiatives in the virtual and real worlds.
Figure 3: The NXTR pick and place machine
3.2 Using digital twin technology
3.2.1 Creating and simulating models
Models are created (figure 4) and then deployed in a virtual space to verify whether efficient production without waste can be achieved by changing operation through the introduction of automated equipment. Simulations are set up using parameters based on actual data from SMT lines, and it is possible to determine the necessary resources such as equipment and manpower, and the load ratio for each operation such as production, changeover, and parts supply, as well as to understand information related to operation such as how many AGVs are required in advance.
The operation of the entire SMT line can be accurately reproduced through simulation, and decisions on equipment selection and operation, which used to rely on the experience of the person in charge, can be visualized in an objective manner in a virtual space.
Figure 4: Simplified model of an SMT line
3.2.2 Creating schedules to perform production
In order to expand the simulation conducted in the virtual world from 3.2.1 to production in the real world, it is necessary to create accurate production plans, and this has probably been a dedicated task because this requires know-how and skills. Therefore, we have a production scheduler tool in the host system that helps to create concrete production plans. This tool uses the various required data, such as the actual data for each process, the cycle time of each machine including the placement machines, and the production times, to create production plans for the entire SMT floor. It can also reflect various conditions such as the timing of parts running out, the number of parts, the floor life of parts, and the maintenance period of each unit, to help make the task of creating accurate production plans for the entire SMT floor as easy as possible.
3.2.3 Initiatives to improve operator work
We have been actively working to automate the external changeover area (the area where materials necessary for the next production are prepared) and the areas around the placement machines to support highly efficient production that does not depend on the skills of operators. However, we have not yet reached the point of fully automating entire SMT lines and reducing the number of operators to zero. For production lines, unintended problems and downtime may occur depending on the work starting time and work order. This means that there is a gap between the simulation of the virtual world and production in the real world that has been described so far, and it is difficult to say that smart factories evolving through digital twins has been realized. While our goal of “zero” downtime remains unchanged, we have developed software that guides the operator through the work in the optimal order and with sufficient time to ensure that downtime is as close to zero as possible. By guiding operators through the necessary tasks according to the progress of the schedule, such as picking (collecting materials required for production), changeover, distribution of materials to equipment, parts replenishment, and maintenance, operators can engage in tasks with confidence and minimize downtime, and this will help minimize downtime. In order to reduce the gap between the virtual world and the real world to “zero”, efforts to monitor and control production conditions in real time and to achieve both high quality and high productivity will be continued, and this will support the realization of the evolving smart factory using digital twin technology.
3.3 Changes in manual work by automating SMT lines
A large portion of the workload in the SMT process is related to part and short stops occur due to issues such as pickup errors when supplying parts. In order to resolve this issue, Fuji has developed various automation units including auto loading feeders. The already mentioned NXTR takes automation a step further to completely automate the process of setting feeders in the placement machines. With the world’s first ever “Smart Loader” for distributing, changing, and setting feeders for the placement machine, it is possible to automate part exchange work. On NXTR lines, by simply setting feeders at buffer stations positioned before the modules, the Smart Loader exchanges the feeders in production automatically according to parts out warnings and the changeover schedule. (Figure 5)
Figure 5: Part exchange work by Smart Loader
Introducing the NXTR to SMT lines changes what manual work needs to be performed by automating the work related to part supply, as we explain below in steps. We envision a transformation from traditional “single stage” operation to “multi stage” operation. (Figure 6) In multi stage operation, preparation and collection work related to parts is centralized in one place, enabling production with a minimum number of workers. However, this is meaningless if production support with the minimum number of people causes an increase in the operator work load or downtime of the machines. These are simulated in the virtual world in advance, and accurate production planning and navigation tools for operation will enable you to achieve operation that is reasonable and has no waste.
Step 1: Single stage operation
A large number of operators for single stages that specialize in feeder replacement are assigned to deal with parts running out or being replaced in the conventional way (Multiple people working on one line).
Step 2: Multi-unit operation
By using a Smart Loader and having one person perform part exchange work at a buffer station, it is possible for one person to support multiple units (One people working on one line).
Step 3: Multi stage operation
By having feeder magazines (magazines in which feeders are set) on the buffer station being exchanged by AGVs, the work performed in front of the machine by operators becomes “zero”.
Figure 6: Changes in manual work through automation
3.4 Changes in manual work by automating insertion processes
In addition to automating SMT processes, we have also been automating insertion processes for the stages after the SMT processes with the multipurpose automated fabrication machine – sFAB-D. In 2021, as new solutions for the manual insertion process, we have developed the sFAB-SH (figure 7), which maintains the excellent flexibility, scalability, and productivity of the sFAB-D, while focusing on the functions required of a standard panel assembly machine, and we have developed the Panel Assembly Robot Cell – SW-BA (figure 8) as part of the Advanced Robot Cell series for the compact multijoint robot SmartWing. sFAB-SH flexibly handles everything from high-speed insertion to insertion of large parts up to 55 mm in height and 200 g in weight with two types of heads; the sH08-SH head and the sH02-SH head. This machine also supports part lead chucks and cutting and clinching to support reliable insertion quality. In addition, defects that are the cause of repair work after parts have been soldered are prevented. Such support includes the high-resolution vision processing system that prevents inserting parts in the incorrect direction and an optimal motion sequence that pushes the part securely with insertion detection to prevent floating parts. The SW-BA excels in the automation of limited types of parts such as connectors, coils, relays, transformers, and large electrolytic capacitors by using a horizontal articulated (SCARA) robot. Part insertion using a SCARA robot may not be new robot technology, but the SW-BA is low cost and enables short setup times by providing the necessary functions as a package, and it can be put into the production line immediately without requiring manual work and system setup by system integrators.
A board on which parts from small sized parts to large and heavy parts that were automatically inserted by an sFAB is shown in figure 9. It is possible to automate the insertion of various parts such as these. There are various requirements for automating insertion. They range from low-cost automatic insertion of just a few parts to high-speed automatic insertion of all parts. We will intently listen to the voices of our users regarding the future vision of their processes and factories, provide optimal solutions, and promote proposals for the realization of smart factories that revolutionize manual work through automation and achieve high operation rates and high profitability, just as we do with placement machines.
Abbildung 9: Platine mit automatisch eingefügten Teilen durch ein sFAB
4. Toward the future
In this article, we have introduced our initiative for simulating the real world in the virtual world for the SMT stage as well as covering our various solutions for automating the insertion process. We will continue to support our users’ realization of smart factories with the evolution of digital twin to link SMT lines with the digital world. We ourselves believe that automation is one of the ways to reduce the gap between the virtual world and the real world to “zero”, but we believe that this is not the only answer. We will continue to listen to our users and develop products and services that exceed their expectations.
Note: This article is a modified version of an article that appeared in the journal “Robot” issue 263.
/wp-content/uploads/2020/09/FUJI-EUROPE-CORPORATION-GmbH_2.jpg6291500Winter_Agentur/wp-content/uploads/2020/11/FJS2_SE_C2_RGB_V2.svgWinter_Agentur2021-12-02 10:52:562021-12-02 10:53:22Placement Technology Trends for 2021 and Latest SMT Solutions
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