Storing and protecting specialist further expands electronics production in Berlin
Kelsterbach, December 5th, 2023 – Swissbit Germany AG is expanding its production capacities and further developing the technological expertise of its semiconductor production at the Berlin site. To this end, Swissbit is relying on placement machines and DIE bonding solutions from FUJI EUROPE CORPORATION (www.fuji-euro.de): The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance in the semiconductor sector with the DIE BONDER DB830plus+. In this way, Swissbit is emphasizing its manufacturing expertise in Europe, which enables the company to react quickly and flexibly to constantly changing market requirements.
Swissbit AG is an European provider of storing products, as well as protecting and embedded IoT solutions for demanding applications. Among other things, the company develops and manufactures industrial-grade storage and security products “Made in Germany”. Swissbit has been producing in Berlin since 2003 and opened a new plant there at the end of 2019 on more than 20,000 square meters of land.
As the only Integrated Device Manufacturer (IDM) for semiconductor storing and security solutions in Germany, Swissbit Germany AG is also an associated partner of the largest EU semiconductor initiative, the IPCEI Microelectronics and Communication Technologies (IPCEI ME/KT). The IPCEI (Important Project of Common European Interest) is being implemented by the European Commission in order to further expand the European semiconductor industry in a targeted manner and thus strengthen the resilience of Europe as a whole.
Independence for high delivery reliability
“Growing digitalization continues to drive demand for semiconductors, as they are indispensable for networking and storage in a wide range of electronic devices, systems and machines. As one of the few European manufacturers of highly integrated industrial memory solutions that produces exclusively in Germany, full control of the production process has always been an integral part of our strategy, as this enables us to guarantee the highest product quality and high delivery reliability,” explains Lars Lust, General Manager APATS (Advanced Packaging, Assembly & Test Solutions) and CEO of Swissbit Germany AG.
Strengthening the market position through increased flexibility
Swissbit has been relying on FUJI placement machines for its in-house production for several years. The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance with the DIE BONDER DB830plus+ from Fasford Technology. Fasford Technology was founded in 1963 as Ome Electronics Kogyousho Co, Ltd, the back-end process group of the semi-conductor division of Hitachi, Ltd. Fasford develops and manufactures DIE bonding equipment and has been a subsidiary of the FUJI CORPORATION Group since 2018.
The NXTIII placement platform from FUJI used at Swissbit is designed for flexible high-mix production. The modular and scalable solution is particularly suitable for the assembly of multi-functional and high-performance electronics with, for example, a high placement density of tiny components and much more. Thanks to its scalability and a high degree of automation, Swissbit can react agilely to market changes.
The newly implemented DIE BONDER DB830plus+ solution is a high-precision DIE bonder with a 2-in-1 concept that supports the stacking of chips with the DAF process and general paste process products. It can be easily switched between direct and parallel operation, enabling flexible production.
“Especially in the rapidly growing semiconductor market, it is crucial to be able to produce quickly and with high quality. By working with FUJI, we can partially automate processes and manufacture with high precision. This gives our production a strong boost,” continues Lars Lust.