Intelligent Screen Printer

GPX Series stencil printers meet the highest process requirements for your solder paste printing combined with excellent value for money with excellent print accuracy, speed and ease of use.

GPX-CII – Large panel production

Optimal repeatability The consistent, high-rigidity machine design from the base to the print section enables high-precision printing for any task.
From ultra-fine patterns (0201 [008004]apertures) to printing large printed circuit board formats, all with process stability. and the durability to maintain printing quality.
High-precision squeegee pressure control and regulation A force cell built into the doctor blade head controls and regulates the pressure in real time, even on non-planar assemblies.
This ensures a uniform and reproducible print result over the entire squeegee path, even when using heavy or long squeegees.
Minimizes maintenance With a combined wet, dry and vacuum cleaning for the stencil underside, which is freely programmable, operation is kept to a minimum.
The area in which the cleaning fluid is applied is automatically adjusted to the width of the assembly.
Only the required amount of liquid is used for effective cleaning.
The Flexible PCB Clamping Stable clamping is achieved through the use of hybrid clamping, which allows the user to choose the optimal clamping method (side clamp/top clamp/edge clamp) according to the characteristics of the plate.
*Option
Direct coupling to SPI Based on the feedback from the downstream SPI evaluation, the printing process can be directly influenced.
Parameters such as underside cleaning, solder paste feed and orientation of the template can be automatically adjusted or started.
This ensures consistent and high print quality.
*Option
Intelligent software The central machine software comprehensively collects and manages the necessary production information.
Thus, production is monitored in real time, so that the time of replacement of materials and consumables can be predicted.
Production programs can be created and transferred offline, and the system provides guidance for batch control and the allocation of materials during the changeover.
*Option
Automatic solder paste feed The amount of paste used is detected (height measurement) and the used paste is automatically supplied as needed.
This means that you can always print with the right amount of paste, which ensures stable print quality.
*Option

GPX-CSII – Dual lane production

Supports a dual-lane concept in a compact housing The GPX-CSII is a compact model that retains the basic functions of the GPX-CII and is suitable for the production of double tracks in the smallest of spaces.

Specification

2024-02_Specifications_FUJI_GPX-CII-CSII-CL.pdf