Limtronik Solves Increasing Placement Complexity with a New SMD Line from FUJI

Reduced Changeover Times, Increased Quality, and Enhanced Flexibility – Thanks to New Placement Machines

Kelsterbach, February 20th, 2025 – The EMS industry is subject to high volatility due to shorter product life cycles, increasing product variations, and the ongoing miniaturization of electronic components. To meet these challenges with maximum flexibility and scalability, EMS provider Limtronik has expanded its production capacity with a new SMD line. This line is based on NXT III placement systems and additional components by FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). As a result, Limtronik has significantly reduced changeover times, increased quality, and enhanced production flexibility.

Like many other companies in the electronics industry, Limtronik faces high dynamism and increasing complexity in manufacturing. “Electronic devices are becoming smaller, while performance, quality, and functionality continue to increase. The miniaturization of PCB structures and components requires placement accuracy of ±30 µm. At the same time, we need to remain highly flexible—sometimes producing small batches, other times handling large-volume orders,” explains Gerd Ohl, Managing Director of Limtronik GmbH.

With the new SMD line, Limtronik has significantly increased its placement capacity. The line includes six new FUJI NXT III placement machines. “This setup theoretically enables a placement performance of up to 122,500 components per hour. At the same time, there are sufficient feeder slots available to easily handle products with a large variety of components”, says Gerd Ohl.

The NXT III is ideal for placing multifunctional and high-performance electronics, particularly when high-density placement of tiny components is required. The machine features a modular, scalable architecture and supports automated processes. This allows Limtronik to execute projects quickly, even under changing conditions.

Faster Changeovers and Maintenance

With the NXT III, Limtronik has significantly reduced changeover times while increasing maintenance efficiency. Feeders and placement heads can be exchanged quickly and flexibly. Additionally, the intelligent setup concept, featuring guided instructions and automated feeder recognition, ensures an error-free changeover. This allows for quick product transitions—regardless of batch size or assembly complexity.

Maintenance has also been optimized through smart automation solutions. The Smart Nozzle Cleaner efficiently cleans, tests, and stores nozzles (placement pipettes), extending their lifespan and ensuring consistent placement quality. At the same time, nozzle nests for the next product are pre-configured, enabling a fast transition between different jobs. This technology not only enhances placement reliability but also significantly reduces production process times.

Process Control Through Monitoring and Traceability

In addition to the new SMD line, Limtronik operates three other lines with FUJI placement systems, all equipped with powerful monitoring and traceability technology. A barcode scanner identifies incoming PCBs using their 2D codes before they enter the first placement module. This enables product-dependent, automatic program adjustments and process interlocking in case of deviations.

Furthermore, Limtronik utilizes a board-skip feedforward function, which automatically prevents defective PCBs—identified as faulty by the SPI—from being placed. This prevents unnecessary placements, reduces scrap, and saves materials and production time. All collected traceability data can be transmitted to higher-level systems for further analysis.

“Limtronik is a highly experienced electronics manufacturer that leverages the advantages of the NXT concept, particularly regarding the ever-growing demand for flexible setup strategies and changing market requirements. The EMS provider is so well positioned that it can quickly adapt to shifting production volumes while maintaining exceptionally high quality,” explains Sascha Frieling, Manager Technology at FUJI EUROPE CORPORATION.

FEIG ELECTRONIC Significantly Increases Output with FUJI Placement Machines

New SMT Line Achieves Significantly Higher Output with Reduced Space Requirements

Kelsterbach, February 5, 2025 – The demand for higher output volumes is rising, along with the complexity of component geometries – all while manufacturing space remains limited. This situation posed a major challenge for FEIG ELECTRONIC’s electronics production, as the existing SMT line became a bottleneck for growing requirements. By implementing a new SMT line based on the NXTR series placement systems and additional components from FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de), the company has transformed its SMT production at its Weilburg site, making it future-ready.

FEIG ELECTRONIC GmbH develops and manufactures its own electronic products – from populated PCBs to complete systems – in the product areas of gate and barrier control systems, RFID and barcode systems, and payment terminals. Demand and output continue to increase, but manufacturing space cannot expand accordingly. In addition, the complexity of component geometries is growing in terms of size, shape, and special designs.

“Our previous placement systems required increasing maintenance and could no longer meet the growing demands for efficiency and flexibility. In December 2024, we installed a new SMT placement line with FUJI machines and experienced noticeable positive effects in a very short time. We were able to significantly increase output – while even saving space,” explains Markus Mink, Operations Manager at FEIG ELECTRONIC.

Higher and Automated Placement Performance in a Smaller Space

The new SMT line at FEIG ELECTRONIC consists of six NXTR S placement systems with an automatic tray changer, Smart Nozzle Cleaner, and a NEXIM software package that integrates HERMES and IPC-CFX interfaces for seamless communication.

The increasing number of PCB layers and the higher demands on placement performance required an extension of the reflow soldering system. Stefan Juchem, Regional Sales Manager at FUJI EUROPE CORPORATION, explains: “The additional space required was ideally offset by the compact design of the NXTR modules. These systems are specifically designed to provide very high placement performance while requiring minimal space. This is particularly beneficial in constrained manufacturing environments in brownfield settings.”

FEIG ELECTRONIC is also successfully managing the increasing complexity of components with the NXTR systems. Since the placement heads and nozzles cover a wide range of components, more complex shapes can be placed automatically. As a result, the number of manually placed components in the THT process is reduced.

Reduced Downtime and Higher Production Quality

Markus Mink summarizes: “With the new SMT line, we have significantly increased the efficiency of placement at our Weilburg site. The first few weeks of experience with the FUJI systems have shown not only increased output but also lower rejection rates and fewer errors, which significantly reduces downtime on the line.”

For FEIG ELECTRONIC, the new SMT line is a key element in maintaining competitiveness in this demanding market. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities.

Welcome 2025 – welcome new opportunities!

The management and the entire FUJI team are looking forward to be at your side in 2025 and wish everyone a successful new year. 💪

We have used the holidays to recharge our energy. We want to convert this into innovations over the next few weeks. A small outlook:

💪 New functions for your progress:

We are developing new technologies and features that will make your placement processes even faster, smarter and more sustainable.

🌍 Strengthening the electronics industry together:

We want to further expand our partnerships in the electronics industry. By pooling our strengths with other specialised companies, we gain even more innovative strength together and can develop holistic solutions that help electronics manufacturers to remain competitive and and strengthen Germany as a business location.

💡 Individual Solutions for individual requirements:

Whether highly complex placement processes or individual automation solutions – requirements are becoming increasingly specialised. We therefore rely on highly modular and customised solutions. In this way, we provide you with targeted support achieve your production goals quickly and precisely.

#HappyNewYear #FUJI

Asteelflash Group Significantly Reduces Changeover Times at Bedford Facility with FUJI Solution

EMS Service Provider Adapts to New Market and Customer Demands

Kelsterbach, December 5th, 2024 – The EMS industry requires more flexible, scalable technologies than ever before to manufacture electronics efficiently and quickly respond to new market de-mands. To achieve high agility and performance, Asteelflash Group relies on solutions from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). The EMS provider has expanded its SMT placement capacity at the Bedford facility with eight modules from FUJI’s NXT III placement platform, NEXIM software, and a Smart Setup Station. This investment has allowed Asteelflash to significantly reduce changeover times and increase flexibility in high-mix production.

Asteelflash is a global electronics manufacturing services (EMS) company offering design, development, and manufacturing services for electronic products. It specializes in producing complex electronic systems for various industries. Like many other companies in the electronics industry, Asteelflash is currently facing multiple changes and challenges in the sector, with high pressure from both innovation and competition.

To address these challenges, Asteelflash decided to modernize its SMT production. The company chose FUJI’s modular NXT III placement solution, which is ideal for assembling multifunctional and high-performance electronics. It allows for high placement density of tiny components. Paired with NEXIM software and the Smart Setup Station, the solution helps Asteelflash automate production processes while achieving the highest precision.

Replacing Outdated Equipment for a Competitive Edge

Asteelflash began the phased installation of the FUJI solution at its Bedford facility in January 2023, with the final modules integrated by September 2024. Thanks to the modular and scalable design of the NXT III, production could resume immediately after the first phase of installation. The new platform replaces outdated equipment, whose limited flexibility and long changeover times had significantly impacted production efficiency.

“One of the key requirements was to reduce changeover times in high-mix production to become faster. Thanks to the FUJI solution, we were able to significantly increase speed, expand our SMT placement capacity, and improve our responsiveness to constantly changing market demands. This has provided us with the flexibility that is essential for the current needs of the EMS industry,” said John Cardi, Engineering Manager at Asteelflash Group.

ELESTA expands sensor placement with FUJI

Increasing demand for security sensors necessitates expansion of placement capacities

Kelsterbach, May 14th, 2024 – ELESTA GmbH, a company within the PILZ Group, has expanded its placement capacity with machines from FUJI. Drivers are increasing demand and growing complexity in the sensor field. ELESTA develops and produces sensors for industrial automation, particularly in the area of functional safety. To ensure the high standards of its products, the company is expanding its production facility with a new placement line from the NXTR series consisting of five NXTR S placement modules from FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de).

ELESTA places various flat assemblies from rigid and semiflexible printed circuit boards, which are used in safety sensors. These sensors serve, among other things, for monitoring safety doors and access control of machinery and equipment. The portfolio ranges from magnetic and mechanical interlocks to Reed and RFID sensors to safety light curtains. Furthermore, ELESTA is globally active as an innovation leader in relays with forcibly guided contact sets according to IEC 61810-3.

“With the constantly growing demand for our sensors and the increased complexity of the products, accompanied by an increase in electronic components on the controllers, it became necessary to expand the placement capacity,” explains Dario Berni, Head of Production Sensors and SMD at ELESTA GmbH.

Therefore, the decision was made by the responsible parties to replace the existing FUJI placement line NXT II. It was replaced by a system consisting of five placement modules from the NXTR S series. The new placement machine offers better printed circuit board handling, more CPH (components per hour), higher flexibility regarding component size with fewer head types. Exchange heads, units, and even complete modules can be replaced without tools. In addition, predictive maintenance is possible with self-diagnosis. This minimizes unplanned production interruptions.

“With the introduction of the new placement system FUJI NXTR S, flat assemblies with very fine structures and high component density can be manufactured with high efficiency. Furthermore, production flexibility is increased, and throughput times are reduced. ELESTA is thus ideally equipped for the needs of the coming years,” says Dario Berni.

Placement capacity and quality synchronously increased: Meinberg relies on all-in-one placement from FUJI

Increasing demand for time and frequency synchronization systems – Placement taken to a new level

Kelsterbach, April 8th, 2024 – Streaming series at ever faster rates, executing applications in real-time on multiple devices synchronously, and uninterrupted telephony – the demands of users in the digitized world are escalating. Meinberg Funkuhren GmbH & Co. (www.meinbergglobal.com) specializes in the development and manufacturing of electronic modules and systems for time and frequency synchronization. To bring very high precision to the manufactured products and high speed to production, the company has opted for several All-in-One placement machines AIMEX IIIc from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de).

“When seamless synchronization ensures that the audio matches the video during binge-watching, when your smartphone and tablet display the exact same time, facilitating uninterrupted phone calls during a car journey, or when real-time data transfers reach their destinations promptly – in these instances, Meinberg products likely play a crucial role,” explains Heiko Gerstung, Managing Director of Meinberg Funkuhren GmbH & Co. KG. The company specializes in the development, production, and distribution of server solutions and related electronic modules tailored to meet the intricate synchronization needs prevalent in such scenarios.

Precise placement for second-accurate results in the end product

Meinberg requires extremely precise PCB placement to ensure that electronic signals can be transmitted correctly. This requires highly precise assembly machines.

At the same time, the increasing demand for Meinberg products necessitates manufacturing to be conducted within progressively shorter timeframes and at elevated speeds. “The placement pace of our prior machines eventually proved inadequate. Hence, in 2019, we implemented a new SMT line equipped with two AIMEX IIIc placement machines from FUJI. Two years later, we augmented this setup with an additional pair of these machines,” explains Heiko Gerstung.

The placement machines are used for all SMD-mounted placements. The production was redesigned for line setup. Due to the compact design of the AIMEX IIIc and its short length, the machines are space-saving in line configuration.

Flexible high-mix-production made easy

The AIMEX IIIc is designed for high-mix production and enables any type of production and changes in the housing forms used. It supports the processing of the smallest chip components to large components in a single machine. All placement heads are equipped with the “Intelligent Parts Sensor.” This ensures continuous monitoring from picking up the components to placement. The DX heads are highly flexible and automatically switch tools from dispensing tasks to mechanical gripping tools for odd-form components to chip shooter tasks. The systems also offers high flexibility. For example, the placement heads can be adjusted to an optimal machine configuration in just a few minutes without tools.

We first encountered the all-in-one placement machine AIMEX IIIc from FUJI at nearby electronics firms and trade exhibitions. Its impressive combination of speed, precision, durability, and cost-effectiveness persuaded us. Our decision has proven fruitful as it enabled us to significantly increase our placement capacity in a short span of time. Should demand continue to grow, we are contemplating expanding our production line,” explains Heiko Gerstung.

FUJI EUROPE CORPORATION at SMTconnect: Automation of placement is the future

The automated and autonomous production is gaining momentum

Kelsterbach, April 3rd, 2024 – Companies have never had to adapt to changing market demands and scale production as rapidly as they do now. Automation is the lever to easily align processes with different product types or production quantities. This also applies to placement. FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de) will showcase components for the FUJI Smart Factory 2.0 at SMTconnect from June 11th to 13th in Nuremberg (Hall 4, Booth 4-321), including various placement machines and newly developed RH placement heads. The goals: zero placement errors, zero machine operators, zero machine stops.

At the exhibition, FUJI presents components of a Smart Factory for SMT and THT placement, which are interconnected in a production line according to the principles of Industry 4.0 via M2M communication with machines from other companies. In the FUJI Smart Factory 2.0, all production-relevant tasks, starting from material preparation and extending beyond printing and placement processes, are intelligently interconnected. The result is a 22 percent reduction in production times.

The R machine series optimizes production preparation and maintenance processes, while automating manual placement processes for comprehensive networking and self-optimized production. In SMT placement, the NXTR-S offers a modular design that allows for quick adjustments to changing production needs. Heads, units, and even entire modules can be replaced without the need for tools. Additionally, the AIMEXR is designed for uninterrupted operation and can accommodate up to 130 different part types, producing panels with dimensions of up to 1,068 x 610 mm.

The sFAB-D, a placement machine designed for automated placement production, streamlines the labor-intensive THT (Through-Hole Technology) placement process, significantly enhancing efficiency while ensuring high precision. This machine offers flexibility to accommodate various part sizes, shapes, and delivery methods, ranging from wired components to larger specialized parts like transformers.

Automation fosters flexibilization

In FUJI’s Smart Factory, automation is aimed at liberating manual tasks and simplifying processes, ultimately speeding them up. This objective also contributes to enhancing the flexibility of SMT manufacturing.

“The complexity, customization, and miniaturization in SMT manufacturing are on the rise.For placement, this means it must be flexible enough to adapt to various components and groups, without compromising precision,” explains Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH

These challenges are supported by the new RH placement heads that FUJI is presenting at the trade show. Among other features, they offer the ability to adjust the clearance height of the placement heads using a so-called sub-Z-axis. With the help of the contact sensor on the head, it is checked whether the part has touched the circuit board. ‘This precision and adaptability increase flexibility in manufacturing and can be particularly useful when processing various components or assemblies that have different requirements for placement,’ says Stefan Janssen.”

The new RH placement heads that FUJI is unveiling at the trade show are compatible with the R machine series (NXTR-A/-S as well as AIMEXR). By combining a newly developed 2RV module with RH28 heads, W08t feeders, and MFU-63 feeder carts, the NXTR achieves a throughput of 120,000 cph (on a 795 mm module length). This represents a 39 percent improvement compared to the NXT III placement machine.

Stefan Janssen explains: “At SMTconnect, FUJI demonstrates further automation solutions that minimize manual tasks, thereby addressing the growing shortage of skilled labor. At the same time, alongside flexibility, high-speed, and high-precision placement, we are increasingly focusing our machines on energy efficiency in line with the urgent need for an industrial energy transition.”

Visitors can experience the NXTR-S in action firsthand via ‘Robust Processes and Technologies through Automation and Digitalization’ as part of the Future Packaging Line, located at booth 4-311 in Hall 4, hosted by Fraunhofer IZM.”

FUJI at InnoElectro: Increasing energy efficiency and productivity in placement

FUJI NXTR S

Meeting the challenges of digitalization and energy transition


FUJI at InnoElectro: Increasing energy efficiency and productivity in placement

Kelsterbach, March 21st, 2024 – There is currently a great deal of untapped potential for energy savings in industrial production – and it is important to leverage this potential as part of the energy transition. FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de) will be demonstrating at InnoElectro from April 23 to 25 in Budapest (booth D05) how productivity increases and energy efficiency in placement can work in harmony. The specialist for electronic pick-and-place machines will be presenting the NXTR-S from its “R-Series” at the trade fair. These are machines that reduce manual activities to a minimum and focus on energy efficiency, flexibility, high-speed and high-precision placement.

“Increasing energy costs in a long-term perspective, climate changes and shrinking resources are making energy efficiency in production an increasingly important strategic issue in the industry. This is why we also pay attention to these factors when developing our electronic pick and place machines. We strive to constantly increase the efficiency of SMT production with our machines and at the same time reduce the environmental impact,” says Ádám Salusinszky, Managing Director Hungarian Branch Office of FUJI EUROPE CORPORATION GmbH.

SMT production needs energy-saving and cost-efficient solutions

At “InnoElectro”, a trade fair for companies involved in the development and manufacturing of electronics-based solutions, FUJI will be demonstrating various automation solutions from the “R-Series”. With its “R” placement machines, FUJI is aiming for highly efficient and agile production that is also designed for sustainability. The pick-and-place machines support a wide range of production types and are very cost-efficient and energy-saving.

The ‘R machine series’ includes the NXTR-S smart factory platform, for example. It offers a modular design that enables quick adjustments to be made when production requirements change. Heads, units and even entire modules can be replaced without tools. In addition, predictive maintenance is possible thanks to self-diagnostics – this prevents sudden machine stops from affecting the production schedule. The pick-and-place machine is also designed for better PCB handling, more CPH – components per hour – and greater flexibility in terms of part size, with fewer head types.

The NXTR models support high-speed panel production, with a high throughput without compromising on quality. The intelligent sensor system ensures stable and high-quality placement. The status of the machine is monitored in real time and the load on components and panels is controlled at the same time.

Hungarian electronics industry on the rise

“At InnoElectro in Hungary, we will be presenting solutions and tools that enable fully automated, efficient processes. This is an important trade fair for us, as the Hungarian electronics industry has grown strongly in recent years and is developing very positively. This is partly due to a boom in investment in electromobility. There is enormous potential for development and optimization in this country, for example in PCB production,” says Ádám Salusinszky.

The business area of the Hungarian branch is very important because we want to offer our regional customers short distances and response times as well as high quality service and support. We have greatly expanded our activities in recent years and serve customers from Hungary, Slovenia, Croatia as well as Bosnia and Herzegovina. We are also focusing on training, as the branch in Budapest is FUJI’s second training center in Europe.

Changes in placement: FUJI shows potential at the “Southern Manufacturing & Electronics”

More automation – even in traditionally manual processes such as THT

Kelsterbach, January 10th, 2024 Automation is increasingly finding its way into the PCB manufacturing process – even in areas that are considered to be the last remaining labor-intensive manual processes, such as THT production. With its sFAB-D, FUJI EUROPE CORPORATION (www.fuji-euro.de) offers a machine for the automation of THT placement processes, which are often still carried out manually. The AIMEX IIIc also enables automated processes for flexible high-mix production and higher productivity. FUJI will be showcasing both solutions at “Southern Manufacturing & Electronics” from February 6-8, 2024 in Farnborough (UK) at stand L80.

Placement processes today are subject to constantly growing requirements with regards to high-mix or variable-mix and variable-volume production. This calls for solutions which enable processes to be adapted quickly and easily and increase speed.

“Speed and flexibility are among the main reasons why many of our customers are increasingly turning to automation – even in areas that have been managed manually for decades,” explains Martin Rennie, Branch Manager UK at FUJI EUROPE CORPORATION GmbH.

The AIMEX IIIc all-in-one placement machine supports all types of production and changes in used package shapes. It allows easy ramp-up of new productions or reaction to changes in package shapes and any errors that occur. Several test functions prevent defects and ensure high quality. Reduced time and labor costs are drastically minimized by advantages such as the reduction in the number of changeovers. Operation is extremely simple thanks to the use of pictograms.

Continuity and flexibility required

Alongside AIMEX IIIc, FUJI is also presenting sFAB-D, a placement machine for automated PCB production, at the “Southern Manufacturing & Electronics” in Farnborough (England). The platform automates THT (Through-Hole Technology) placement processes and thus increases efficiency significantly – while maintaining high precision. It flexibly supports various part sizes, shapes and delivery types, from leaded components to large special components such as transformers, etc.

Through-hole technology is a labor-intensive method for manufacturing PCBs, as components are inserted through holes on the board and then soldered on the other side.

Vasilii Afanasev, sFAB Manager at FUJI EUROPE CORPORATION GmbH, explains: “Inserting and soldering the components is usually done manually and is therefore very time-consuming. The automation of THT board placement provides an alternative. It relieves employees of laborious, monotonous work and makes the placement workstations more effective. It also helps to ensure quality. Modern production relies on automated processes to ensure the high level of efficiency and competitiveness that is essential today.”

FUJI will be exhibiting both placement machines at “Southern Manufacturing & Electronics” from February 6 – 8, 2024 in Farnborough (UK) on stand L80.

Swissbit expands its machine park with FUJI solutions and strengthens in-house production

Storing and protecting specialist further expands electronics production in Berlin

Kelsterbach, December 5th, 2023 – Swissbit Germany AG is expanding its production capacities and further developing the technological expertise of its semiconductor production at the Berlin site. To this end, Swissbit is relying on placement machines and DIE bonding solutions from FUJI EUROPE CORPORATION (www.fuji-euro.de): The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance in the semiconductor sector with the DIE BONDER DB830plus+. In this way, Swissbit is emphasizing its manufacturing expertise in Europe, which enables the company to react quickly and flexibly to constantly changing market requirements.

Swissbit AG is an European provider of storing products, as well as protecting and embedded IoT solutions for demanding applications. Among other things, the company develops and manufactures industrial-grade storage and security products “Made in Germany”. Swissbit has been producing in Berlin since 2003 and opened a new plant there at the end of 2019 on more than 20,000 square meters of land.

As the only Integrated Device Manufacturer (IDM) for semiconductor storing and security solutions in Germany, Swissbit Germany AG is also an associated partner of the largest EU semiconductor initiative, the IPCEI Microelectronics and Communication Technologies (IPCEI ME/KT). The IPCEI (Important Project of Common European Interest) is being implemented by the European Commission in order to further expand the European semiconductor industry in a targeted manner and thus strengthen the resilience of Europe as a whole.

Independence for high delivery reliability

“Growing digitalization continues to drive demand for semiconductors, as they are indispensable for networking and storage in a wide range of electronic devices, systems and machines. As one of the few European manufacturers of highly integrated industrial memory solutions that produces exclusively in Germany, full control of the production process has always been an integral part of our strategy, as this enables us to guarantee the highest product quality and high delivery reliability,” explains Lars Lust, General Manager APATS (Advanced Packaging, Assembly & Test Solutions) and CEO of Swissbit Germany AG.

Strengthening the market position through increased flexibility

Swissbit has been relying on FUJI placement machines for its in-house production for several years. The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance with the DIE BONDER DB830plus+ from Fasford Technology. Fasford Technology was founded in 1963 as Ome Electronics Kogyousho Co, Ltd, the back-end process group of the semi-conductor division of Hitachi, Ltd. Fasford develops and manufactures DIE bonding equipment and has been a subsidiary of the FUJI CORPORATION Group since 2018.

The NXTIII placement platform from FUJI used at Swissbit is designed for flexible high-mix production. The modular and scalable solution is particularly suitable for the assembly of multi-functional and high-performance electronics with, for example, a high placement density of tiny components and much more. Thanks to its scalability and a high degree of automation, Swissbit can react agilely to market changes.

The newly implemented DIE BONDER DB830plus+ solution is a high-precision DIE bonder with a 2-in-1 concept that supports the stacking of chips with the DAF process and general paste process products. It can be easily switched between direct and parallel operation, enabling flexible production.

“Especially in the rapidly growing semiconductor market, it is crucial to be able to produce quickly and with high quality. By working with FUJI, we can partially automate processes and manufacture with high precision. This gives our production a strong boost,” continues Lars Lust.