Schubert Makes Major Investment and Expands Production Capacity in Germany

Kelsterbach, September 8th, 2026 – Schubert System Elektronik GmbH is investing €4.5 million in the continued modernisation of its electronics manufacturing operations at its headquarters in Neuhausen ob Eck, Germany. After FUJI EUROPE implemented an SMT production line for Schubert’s in-house PCB manufacturing as general contractor in 2021/2022, FUJI is once again responsible for the overall project planning and implementation of the current expansion. With new production and automation solutions, Schubert is further developing its manufacturing capabilities with a focus on efficiency, precision and process reliability. The aim is to strengthen the long-term competitiveness of its German production site.

Schubert System Elektronik GmbH develops and manufactures, among other products, sensor systems for tool monitoring, industrial PCs, touch monitors and embedded computing solutions. Increasing output requirements and growing cost pressures in international competition are placing high demands on electronics manufacturing in Germany. Schubert is therefore pursuing the consistent further development and automation of its manufacturing processes.

When setting up the SMT production line in 2021/2022, Schubert had already commissioned FUJI, a specialist in SMT placement equipment, to manage the overall project. With the new line, the company brought part of its PCB manufacturing, which had previously been outsourced to EMS providers, back in-house, thereby increasing its vertical integration and flexibility.

Building on this foundation, Schubert is now taking the next step in developing its electronics manufacturing operations and is once again relying on FUJI. The company is planning and coordinating the overall project, integrating the technology partners involved and bringing together the various production and automation solutions.

“Working with FUJI provides our team with a central and proven point of contact, clearly defined responsibilities and fewer interfaces during implementation,” explains Matthias Klein, CEO of Schubert System Elektronik GmbH.

Intelligently Connected Production and Automation Technology

For Schubert’s electronics manufacturing operations, FUJI combines its own technologies with solutions from specialised partners. The SMT line implemented in 2021/2022, featuring two FUJI AIMEX IIIc placement machines, will continue to be used for low-volume production, prototypes and a high mix of product variants. As part of the current expansion, Schubert is complementing this existing line with a new SMT line featuring five FUJI NXTR S placement machines, designed for high production volumes and correspondingly higher throughput.

For the current expansion, the ASYS Group is supplying various production and automation solutions. These include handling and automation modules within the line as well as the SERIO 4000 stencil printing system. The manufacturing setup is complemented by a separate stand-alone solution featuring the ATHOS test system, which is also equipped with ASYS handling solutions.

FUJI and ASYS have a long-standing partnership and have successfully implemented numerous joint projects. The combination of the different, precisely coordinated systems enables an overall solution tailored specifically to Schubert’s requirements.

Laser and Soldering Technology Increase Precision and Process Quality

Further modernisation measures at Schubert include new laser technology for depanelising PCBs. During production, several individual PCBs are initially combined into a single panel, known as a production panel, and are subsequently separated from one another. While Schubert previously used a semi-automated roller cutter for this process, the new technology separates the boards contact-free using a laser. This reduces mechanical stress on sensitive electronic assemblies while enabling precise and reproducible processing.

Schubert is also increasing its level of automation when selectively soldering THT components. A process that previously required a high degree of manual skill is now handled by a selective soldering system: Components inserted through the PCB are soldered automatically under constant process conditions. This supports consistent and reproducible production quality and helps to reduce defects, rework and scrap.

SMD Production 2.5 Times Faster

The further development of Schubert’s electronics manufacturing is already delivering measurable results. According to Schubert, the new SMD line operates 2.5 times faster than the previous line, which was deliberately designed for low-volume, high-mix production. Further investments in the electronics manufacturing area have also improved traceability and inventory accuracy. This helps reduce errors and deviations while ensuring a high level of transparency in the event of customer complaints.

“With the establishment of its own PCB manufacturing capabilities, Schubert took an important step towards greater vertical integration and flexibility in 2021/2022. The current expansion is the logical next step: the focus is now on further automation and process optimisation. With our Turnkey Solutions, we are supporting Schubert on this journey with holistic solutions for efficient and competitive SMT manufacturing,” says Jochen Krisch, Sales Manager Turnkey Solutions at FUJI EUROPE CORPORATION GmbH.

Combining Compactness and Production Flexibility to Meet Diverse Requirements

Kelsterbach, June 11th, 2026 – FUJI CORPORATION has developed the CLT-FG, a new placement machine that combines compactness and flexibility to meet a wide range of production requirements. Featuring an exceptionally compact design with a machine width of just one meter, the CLT-FG addresses a broad spectrum of manufacturing needs. It is particularly suited for production environments characterized by high product variety and small lot sizes, enabling flexible, stable, and efficient manufacturing.

In recent years, production facilities have faced increasing demands due to the growing diversification of electronic devices, technological innovations, and shorter product life cycles. These challenges include greater product variety, smaller production volumes, and the need to adapt manufacturing processes quickly to fluctuating demand.

At the same time, the introduction of new equipment presents companies with several challenges. These include ensuring sufficient performance for day-to-day production operations, securing adequate installation space, and managing the associated operational workload. As a result, selecting the optimal equipment has become a key priority.

Against this backdrop, FUJI developed the CLT-FG—a new placement machine designed to accommodate a broad range of production requirements. Based on customer feedback, the company focused on addressing the specific needs of modern manufacturing environments. Particular emphasis was placed on combining a compact footprint with a high degree of flexibility. The result is a machine that can be seamlessly integrated even where space is limited while meeting diverse production demands.

CLT-FG Features

1. Flexibility for Diverse Production Requirements
   The CLT-FG is equipped with a versatile placement head capable of handling a wide range of components. From high-speed placement of small chip components to the stable handling of large components, the CLT-FG supports the production of a diverse range of products. It adapts flexibly to manufacturing environments characterized by high product variety, low production volumes, and frequent product changeovers, enabling efficient production.
   
2. Compact Design for Easy Installation
   With its compact design and width of approximately one meter, the machine is optimally suited to the diverse requirements of different production sites and offers greater flexibility regarding installation locations. A streamlined machine and system configuration helps minimize effort during both installation and operation.
   
3. High-Quality Placement Backed by Proven Technology
   By leveraging FUJI’s proven, state-of-the-art placement technologies and existing platform resources, the machine is capable of meeting a wide variety of production requirements. It delivers high-quality placement through stable operation and exceptional reliability. The design also takes compatibility with existing equipment into account, ensuring smooth integration and operation.
   The CLT-FG will be unveiled globally for the first time at JISSO PROTEC 2026, an exhibition for electronic assembly and packaging technologies, taking place in June 2026 at Tokyo Big Sight.
   

Manual Processes Replaced: Enabling High Volumes and Process Stability

Kelsterbach, May 7th, 2026 – While surface-mount technology (SMT) processes in electronics manufacturing are now largely automated, through-hole technology (THT) assembly often still relies on manual operations. W. Kolb Fertigungstechnik GmbH has now modernized this area in a targeted manner: by implementing the sFAB-D from FUJI EUROPE CORPORATION GmbH, the full-service electronics manufacturer has automated key THT assembly processes. This enables the company to produce high volumes with stable processes, repeatable accuracy, and consistently high quality.

W. Kolb has been manufacturing electronic assemblies since 1988 and, as a full-service provider, offers a comprehensive range of services—from production, testing, and inspection to logistics. The company employs around 210 people at its Willich site. In 2024, W. Kolb generated revenue of approximately €58 million and produced 10.5 million finished units, incorporating around 250 million electronic components.

Production is focused on demanding industrial sectors, including automotive, sensor technology, environmental technology, medical technology, and monitoring systems for rail vehicles. In SMT manufacturing, W. Kolb operates four high-performance ASMPT lines with inline SPI and AOI. The efficiency of all placement lines is monitored in real time via software and continuously optimized. In THT production, three lines with individual setups are available, including two wave soldering systems and one selective soldering system. THT assembly processes that could not previously be automated were traditionally performed manually.

“Our goal was to replace time-consuming manual insertion with a scalable automation solution—particularly for recurring tasks and high-volume production,” explains Timo Kluge, Head of SMT Production at W. Kolb. “After a comprehensive market analysis, we chose FUJI for the first time. The sFAB platform proved to be a technical benchmark in terms of precision, flexibility, and component variety.”

FUJI sFAB-D Handles the Majority of THT Assembly
With the integration of the sFAB-D, W. Kolb has significantly increased efficiency in THT assembly. The automated solution now handles the majority of insertion tasks, substantially reducing manual effort. At the same time, it ensures high processing speed and consistently high repeatability.

At W. Kolb, the system is equipped with two universal sH02 placement heads, including part presence check. Feeding is handled via a comprehensive feeder setup that supports radial and axial components as well as parts supplied in tube magazines. This allows processing of a wide range of THT components—from radial and axial parts to components in stick feeders.

“The sFAB-D has fully met our expectations. Thanks to the universal sH02 heads and the wide range of feeding options, we can now automate a large portion of our THT portfolio,” says Timo Kluge. “The combination of precision and speed enables us to ensure consistently high quality, even at high volumes.”

Smart Combination of Automation and Manual Assembly
At W. Kolb, the new solution does not replace existing THT expertise but complements it. While complex or specialized assembly tasks continue to be carried out manually, the sFAB-D handles standardized and recurring processes. This creates an efficient combination of automated assembly and flexible manual work.

At the same time, automation frees up employees to focus more on quality assurance and process-related tasks.

Fast Integration and Immediate Productivity
Installation and commissioning of the sFAB-D took place in March 2026. The system was integrated into existing production processes on schedule and was ready for productive use immediately after installation. Operator training was also completed quickly, enabling safe use of the system in day-to-day production within a short time.

The positive effects became evident early on: within the first month of full operation, the system proved itself in daily use and met high expectations in terms of reliability and performance.

Investment in Scalable Automation
This investment underscores W. Kolb’s strategic commitment to consistently advancing automation in electronics manufacturing. The goal is to reduce manual assembly wherever automated processes can deliver greater stability, speed, and quality.
W. Kolb also plans to further expand automation in the future and continuously optimize existing processes. The FUJI sFAB-D represents a key building block within THT production.

Pursuing next-generation placement technology in the AI era

Kelsterbach, January 20th, 2026 – FUJI CORPORATION (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as “Fuji”) is pleased to announce that it has achieved the world’s first placement of 016008 mm (0.16 x 0.08 mm or 006 x 003 inches) size components on printed circuit boards (PCBs) with its SMT pick and place machine, NXTR, following the successful development of machine technology designed to handle next-generation ultra-small electronic components.

This achievement will be showcased at the 40th NEPCON JAPAN – Electronics R&D and Manufacturing Technology Expo exhibition, January 21, 2026 at Tokyo Big Sight.

There is currently an accelerating shift toward edge AI, where AI processing is performed on the device itself. An era is also emerging in which a wide range of everyday devices, including smartphones, wearable devices, and even medical and healthcare equipment, are autonomously analyze information. Amid these trends toward greater functionality in electronic devices, the number of mounted electronic components is increasing significantly. As a result, further miniaturization and higher-density integration of electronic components have become critical and unavoidable technological challenges.

Even the 0201 mm (0.25 x 0.125 mm, 008004 inches) size component, which has long been considered the smallest standard among currently commercialized electronic components, will eventually reach its limits in the pursuit of higher density to integrate more electronic functions into limited board space. A next-generation component size, 016008 mm (006003″), is being developed in response. 016008 mm (006003″) size components require approximately half of the placement area compared to 0201 mm size components, allowing for higher-density circuit designs.

Four key control technologies enabling the world’s first 016008 mm (006003″) size component placementVier Technologien realisieren die Bestückung von 016008-mm-Bauteilen

FUJI has been providing high-speed, high-accuracy pick and place machines capable of reliably handling very small components. Advancements in the following four key control technologies have made the world’s first placement of 016008 mm (006003″) size components on PCBs possible.

1. Stance recognition during handling
   The orientation and stance of very small components are checked in real time to ensure optimal part handling.
2. Highly-accurate part pickup control
   Deviations in pickup position and the effects of static electricity are addressed for stable part pickup.
3. Super-fine control of placement pressure
   Pressure is precisely controlled to ensure that very small components are not damaged during placement.
4. Ultra-high precision placement positioning control
   With nano-level position compensation, the highest level of placement accuracy in the industry is achieved.

Aiming to build a comprehensive solution for next-generation very small component placement

To place components 016008 mm (006003″) or smaller, it is essential to optimize not only the placement process but also all processes related to placement, including panel design, solder paste materials, stencils, reflow, and inspection, at a high level.

FUJI is developing machine technology for placement robots while deepening cooperation with partners to build a total process solution, including production materials and related materials, taking the race for the miniaturization of electronic components to a new stage as the edge AI era gets fully underway.

Automated, Data-Driven Placement for Zero Placement Errors, Zero Operators, Zero Downtime, and Zero Limits

Kelsterbach, September 9th, 2025 – Zero errors, zero operators, zero downtime, zero limits: At productronica 2025, FUJI EUROPE CORPORATION (www.fuji-euro.de) will demonstrate how this vision can become reality in electronics manufacturing. From November 18 to 21 in Munich, the company will present the “FUJI Smart Factory 2.0” at booth 317 in hall A3 – a modular system for automated, data-driven placement processes.

“Just like in Kyūdō, the Japanese art of archery, electronics manufacturing requires precision, clarity, and utmost focus. Every move, every process step has to hit the target – without detours, without waste. Under the motto ‘No waste, just results. Target Zero.’ we will demonstrate at productronica how intelligent and efficient SMT production is becoming reality,” explains Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH.

FUJI will demonstrate Smart Factory components for both SMT and THT placement. These are linked in a production line with other manufacturers’ machines via Industry 4.0 M2M communication. Within the so-called “FUJI Smart Factory 2.0” (FSF 2.0), all production-related tasks – starting from material preparation through printing and placement – are intelligently connected. The result: production times reduced by 22 percent.

FSF 2.0 is a concept for a highly intelligent, self-optimizing production environment based on networked, autonomous machines. Its goal: production without errors, downtime, or limitations. At its core is seamless data exchange between machines and integration into a flexible manufacturing system that supports individual requirements, such as one-off production or high product variety.

FUJI’s Target ZERO Strategy in Action

FUJI’s Target ZERO strategy is implemented in the NXTR A model. Its objective: zero placement errors, zero machine operators, zero unplanned downtime, and zero placement limits.

A key element here is the Smart Loader. It automatically retrieves the feeders and nozzles needed for upcoming jobs from Smart Storage. Together with AMRs (Autonomous Mobile Robots), these materials are delivered to the production line on time and without manual intervention. This eliminates time-consuming searching and setup work, while ensuring continuous supply to the line. All setups are automatically positioned at the optimal location for maximum productivity – meaning family setups, clustering, or grouping are no longer necessary. The Smart Loader therefore plays a decisive role in achieving “Zero Operators” and “Zero Downtime” by maintaining a seamless material flow.

“Zero Placement Errors” are enabled by tight SPI/AOI integration, automatic error correction, full board ID traceability, and AI-driven analysis of 5M+E data. Potential defects are detected early and automatically corrected. “Zero Operators” are achieved through automated part provisioning (location management, large part supply units), AMR-supported logistics, and visual setup/operation guidance that minimizes manual input. With predictive maintenance, real-time monitoring of all line components, and mobile alerts via FSF Mobile Conductor, “Zero Downtime” becomes attainable.

“Zero Placement Limits” are not just a matter of higher machine performance. They arise from the combination of modular machines, flexible feeding and supply concepts, and data-driven program and process change mechanisms – for example, program changes triggered by a simple scan code. This allows a much broader range of components and panel variations to be processed per line without compromising precision.

Stefan Janssen adds: “Some Target ZERO effects can already be achieved through individual machine functions or modules. For example, at productronica we will present a new all-in-one placement head for our AIMEXR model – flexible for both high-mix and high-volume production. But FUJI Smart Factory 2.0 is the level where all these technical building blocks come together, multiplying their impact across the entire production line. We are driving our Target ZERO strategy forward by combining automation with AI intelligence.”