ELESTA expands sensor placement with FUJI

Increasing demand for security sensors necessitates expansion of placement capacities

Kelsterbach, May 14th, 2024 – ELESTA GmbH, a company within the PILZ Group, has expanded its placement capacity with machines from FUJI. Drivers are increasing demand and growing complexity in the sensor field. ELESTA develops and produces sensors for industrial automation, particularly in the area of functional safety. To ensure the high standards of its products, the company is expanding its production facility with a new placement line from the NXTR series consisting of five NXTR S placement modules from FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de).

ELESTA places various flat assemblies from rigid and semiflexible printed circuit boards, which are used in safety sensors. These sensors serve, among other things, for monitoring safety doors and access control of machinery and equipment. The portfolio ranges from magnetic and mechanical interlocks to Reed and RFID sensors to safety light curtains. Furthermore, ELESTA is globally active as an innovation leader in relays with forcibly guided contact sets according to IEC 61810-3.

“With the constantly growing demand for our sensors and the increased complexity of the products, accompanied by an increase in electronic components on the controllers, it became necessary to expand the placement capacity,” explains Dario Berni, Head of Production Sensors and SMD at ELESTA GmbH.

Therefore, the decision was made by the responsible parties to replace the existing FUJI placement line NXT II. It was replaced by a system consisting of five placement modules from the NXTR S series. The new placement machine offers better printed circuit board handling, more CPH (components per hour), higher flexibility regarding component size with fewer head types. Exchange heads, units, and even complete modules can be replaced without tools. In addition, predictive maintenance is possible with self-diagnosis. This minimizes unplanned production interruptions.

“With the introduction of the new placement system FUJI NXTR S, flat assemblies with very fine structures and high component density can be manufactured with high efficiency. Furthermore, production flexibility is increased, and throughput times are reduced. ELESTA is thus ideally equipped for the needs of the coming years,” says Dario Berni.

Placement capacity and quality synchronously increased: Meinberg relies on all-in-one placement from FUJI

Increasing demand for time and frequency synchronization systems – Placement taken to a new level

Kelsterbach, April 8th, 2024 – Streaming series at ever faster rates, executing applications in real-time on multiple devices synchronously, and uninterrupted telephony – the demands of users in the digitized world are escalating. Meinberg Funkuhren GmbH & Co. (www.meinbergglobal.com) specializes in the development and manufacturing of electronic modules and systems for time and frequency synchronization. To bring very high precision to the manufactured products and high speed to production, the company has opted for several All-in-One placement machines AIMEX IIIc from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de).

“When seamless synchronization ensures that the audio matches the video during binge-watching, when your smartphone and tablet display the exact same time, facilitating uninterrupted phone calls during a car journey, or when real-time data transfers reach their destinations promptly – in these instances, Meinberg products likely play a crucial role,” explains Heiko Gerstung, Managing Director of Meinberg Funkuhren GmbH & Co. KG. The company specializes in the development, production, and distribution of server solutions and related electronic modules tailored to meet the intricate synchronization needs prevalent in such scenarios.

Precise placement for second-accurate results in the end product

Meinberg requires extremely precise PCB placement to ensure that electronic signals can be transmitted correctly. This requires highly precise assembly machines.

At the same time, the increasing demand for Meinberg products necessitates manufacturing to be conducted within progressively shorter timeframes and at elevated speeds. “The placement pace of our prior machines eventually proved inadequate. Hence, in 2019, we implemented a new SMT line equipped with two AIMEX IIIc placement machines from FUJI. Two years later, we augmented this setup with an additional pair of these machines,” explains Heiko Gerstung.

The placement machines are used for all SMD-mounted placements. The production was redesigned for line setup. Due to the compact design of the AIMEX IIIc and its short length, the machines are space-saving in line configuration.

Flexible high-mix-production made easy

The AIMEX IIIc is designed for high-mix production and enables any type of production and changes in the housing forms used. It supports the processing of the smallest chip components to large components in a single machine. All placement heads are equipped with the “Intelligent Parts Sensor.” This ensures continuous monitoring from picking up the components to placement. The DX heads are highly flexible and automatically switch tools from dispensing tasks to mechanical gripping tools for odd-form components to chip shooter tasks. The systems also offers high flexibility. For example, the placement heads can be adjusted to an optimal machine configuration in just a few minutes without tools.

We first encountered the all-in-one placement machine AIMEX IIIc from FUJI at nearby electronics firms and trade exhibitions. Its impressive combination of speed, precision, durability, and cost-effectiveness persuaded us. Our decision has proven fruitful as it enabled us to significantly increase our placement capacity in a short span of time. Should demand continue to grow, we are contemplating expanding our production line,” explains Heiko Gerstung.

FUJI EUROPE CORPORATION at SMTconnect: Automation of placement is the future

The automated and autonomous production is gaining momentum

Kelsterbach, April 3rd, 2024 – Companies have never had to adapt to changing market demands and scale production as rapidly as they do now. Automation is the lever to easily align processes with different product types or production quantities. This also applies to placement. FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de) will showcase components for the FUJI Smart Factory 2.0 at SMTconnect from June 11th to 13th in Nuremberg (Hall 4, Booth 4-321), including various placement machines and newly developed RH placement heads. The goals: zero placement errors, zero machine operators, zero machine stops.

At the exhibition, FUJI presents components of a Smart Factory for SMT and THT placement, which are interconnected in a production line according to the principles of Industry 4.0 via M2M communication with machines from other companies. In the FUJI Smart Factory 2.0, all production-relevant tasks, starting from material preparation and extending beyond printing and placement processes, are intelligently interconnected. The result is a 22 percent reduction in production times.

The R machine series optimizes production preparation and maintenance processes, while automating manual placement processes for comprehensive networking and self-optimized production. In SMT placement, the NXTR-S offers a modular design that allows for quick adjustments to changing production needs. Heads, units, and even entire modules can be replaced without the need for tools. Additionally, the AIMEXR is designed for uninterrupted operation and can accommodate up to 130 different part types, producing panels with dimensions of up to 1,068 x 610 mm.

The sFAB-D, a placement machine designed for automated placement production, streamlines the labor-intensive THT (Through-Hole Technology) placement process, significantly enhancing efficiency while ensuring high precision. This machine offers flexibility to accommodate various part sizes, shapes, and delivery methods, ranging from wired components to larger specialized parts like transformers.

Automation fosters flexibilization

In FUJI’s Smart Factory, automation is aimed at liberating manual tasks and simplifying processes, ultimately speeding them up. This objective also contributes to enhancing the flexibility of SMT manufacturing.

“The complexity, customization, and miniaturization in SMT manufacturing are on the rise.For placement, this means it must be flexible enough to adapt to various components and groups, without compromising precision,” explains Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH

These challenges are supported by the new RH placement heads that FUJI is presenting at the trade show. Among other features, they offer the ability to adjust the clearance height of the placement heads using a so-called sub-Z-axis. With the help of the contact sensor on the head, it is checked whether the part has touched the circuit board. ‘This precision and adaptability increase flexibility in manufacturing and can be particularly useful when processing various components or assemblies that have different requirements for placement,’ says Stefan Janssen.”

The new RH placement heads that FUJI is unveiling at the trade show are compatible with the R machine series (NXTR-A/-S as well as AIMEXR). By combining a newly developed 2RV module with RH28 heads, W08t feeders, and MFU-63 feeder carts, the NXTR achieves a throughput of 120,000 cph (on a 795 mm module length). This represents a 39 percent improvement compared to the NXT III placement machine.

Stefan Janssen explains: “At SMTconnect, FUJI demonstrates further automation solutions that minimize manual tasks, thereby addressing the growing shortage of skilled labor. At the same time, alongside flexibility, high-speed, and high-precision placement, we are increasingly focusing our machines on energy efficiency in line with the urgent need for an industrial energy transition.”

Visitors can experience the NXTR-S in action firsthand via ‘Robust Processes and Technologies through Automation and Digitalization’ as part of the Future Packaging Line, located at booth 4-311 in Hall 4, hosted by Fraunhofer IZM.”

FUJI at InnoElectro: Increasing energy efficiency and productivity in placement

FUJI NXTR S

Meeting the challenges of digitalization and energy transition


FUJI at InnoElectro: Increasing energy efficiency and productivity in placement

Kelsterbach, March 21st, 2024 – There is currently a great deal of untapped potential for energy savings in industrial production – and it is important to leverage this potential as part of the energy transition. FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de) will be demonstrating at InnoElectro from April 23 to 25 in Budapest (booth D05) how productivity increases and energy efficiency in placement can work in harmony. The specialist for electronic pick-and-place machines will be presenting the NXTR-S from its “R-Series” at the trade fair. These are machines that reduce manual activities to a minimum and focus on energy efficiency, flexibility, high-speed and high-precision placement.

“Increasing energy costs in a long-term perspective, climate changes and shrinking resources are making energy efficiency in production an increasingly important strategic issue in the industry. This is why we also pay attention to these factors when developing our electronic pick and place machines. We strive to constantly increase the efficiency of SMT production with our machines and at the same time reduce the environmental impact,” says Ádám Salusinszky, Managing Director Hungarian Branch Office of FUJI EUROPE CORPORATION GmbH.

SMT production needs energy-saving and cost-efficient solutions

At “InnoElectro”, a trade fair for companies involved in the development and manufacturing of electronics-based solutions, FUJI will be demonstrating various automation solutions from the “R-Series”. With its “R” placement machines, FUJI is aiming for highly efficient and agile production that is also designed for sustainability. The pick-and-place machines support a wide range of production types and are very cost-efficient and energy-saving.

The ‘R machine series’ includes the NXTR-S smart factory platform, for example. It offers a modular design that enables quick adjustments to be made when production requirements change. Heads, units and even entire modules can be replaced without tools. In addition, predictive maintenance is possible thanks to self-diagnostics – this prevents sudden machine stops from affecting the production schedule. The pick-and-place machine is also designed for better PCB handling, more CPH – components per hour – and greater flexibility in terms of part size, with fewer head types.

The NXTR models support high-speed panel production, with a high throughput without compromising on quality. The intelligent sensor system ensures stable and high-quality placement. The status of the machine is monitored in real time and the load on components and panels is controlled at the same time.

Hungarian electronics industry on the rise

“At InnoElectro in Hungary, we will be presenting solutions and tools that enable fully automated, efficient processes. This is an important trade fair for us, as the Hungarian electronics industry has grown strongly in recent years and is developing very positively. This is partly due to a boom in investment in electromobility. There is enormous potential for development and optimization in this country, for example in PCB production,” says Ádám Salusinszky.

The business area of the Hungarian branch is very important because we want to offer our regional customers short distances and response times as well as high quality service and support. We have greatly expanded our activities in recent years and serve customers from Hungary, Slovenia, Croatia as well as Bosnia and Herzegovina. We are also focusing on training, as the branch in Budapest is FUJI’s second training center in Europe.

Changes in placement: FUJI shows potential at the “Southern Manufacturing & Electronics”

More automation – even in traditionally manual processes such as THT

Kelsterbach, January 10th, 2024 Automation is increasingly finding its way into the PCB manufacturing process – even in areas that are considered to be the last remaining labor-intensive manual processes, such as THT production. With its sFAB-D, FUJI EUROPE CORPORATION (www.fuji-euro.de) offers a machine for the automation of THT placement processes, which are often still carried out manually. The AIMEX IIIc also enables automated processes for flexible high-mix production and higher productivity. FUJI will be showcasing both solutions at “Southern Manufacturing & Electronics” from February 6-8, 2024 in Farnborough (UK) at stand L80.

Placement processes today are subject to constantly growing requirements with regards to high-mix or variable-mix and variable-volume production. This calls for solutions which enable processes to be adapted quickly and easily and increase speed.

“Speed and flexibility are among the main reasons why many of our customers are increasingly turning to automation – even in areas that have been managed manually for decades,” explains Martin Rennie, Branch Manager UK at FUJI EUROPE CORPORATION GmbH.

The AIMEX IIIc all-in-one placement machine supports all types of production and changes in used package shapes. It allows easy ramp-up of new productions or reaction to changes in package shapes and any errors that occur. Several test functions prevent defects and ensure high quality. Reduced time and labor costs are drastically minimized by advantages such as the reduction in the number of changeovers. Operation is extremely simple thanks to the use of pictograms.

Continuity and flexibility required

Alongside AIMEX IIIc, FUJI is also presenting sFAB-D, a placement machine for automated PCB production, at the “Southern Manufacturing & Electronics” in Farnborough (England). The platform automates THT (Through-Hole Technology) placement processes and thus increases efficiency significantly – while maintaining high precision. It flexibly supports various part sizes, shapes and delivery types, from leaded components to large special components such as transformers, etc.

Through-hole technology is a labor-intensive method for manufacturing PCBs, as components are inserted through holes on the board and then soldered on the other side.

Vasilii Afanasev, sFAB Manager at FUJI EUROPE CORPORATION GmbH, explains: “Inserting and soldering the components is usually done manually and is therefore very time-consuming. The automation of THT board placement provides an alternative. It relieves employees of laborious, monotonous work and makes the placement workstations more effective. It also helps to ensure quality. Modern production relies on automated processes to ensure the high level of efficiency and competitiveness that is essential today.”

FUJI will be exhibiting both placement machines at “Southern Manufacturing & Electronics” from February 6 – 8, 2024 in Farnborough (UK) on stand L80.

Swissbit expands its machine park with FUJI solutions and strengthens in-house production

Storing and protecting specialist further expands electronics production in Berlin

Kelsterbach, December 5th, 2023 – Swissbit Germany AG is expanding its production capacities and further developing the technological expertise of its semiconductor production at the Berlin site. To this end, Swissbit is relying on placement machines and DIE bonding solutions from FUJI EUROPE CORPORATION (www.fuji-euro.de): The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance in the semiconductor sector with the DIE BONDER DB830plus+. In this way, Swissbit is emphasizing its manufacturing expertise in Europe, which enables the company to react quickly and flexibly to constantly changing market requirements.

Swissbit AG is an European provider of storing products, as well as protecting and embedded IoT solutions for demanding applications. Among other things, the company develops and manufactures industrial-grade storage and security products “Made in Germany”. Swissbit has been producing in Berlin since 2003 and opened a new plant there at the end of 2019 on more than 20,000 square meters of land.

As the only Integrated Device Manufacturer (IDM) for semiconductor storing and security solutions in Germany, Swissbit Germany AG is also an associated partner of the largest EU semiconductor initiative, the IPCEI Microelectronics and Communication Technologies (IPCEI ME/KT). The IPCEI (Important Project of Common European Interest) is being implemented by the European Commission in order to further expand the European semiconductor industry in a targeted manner and thus strengthen the resilience of Europe as a whole.

Independence for high delivery reliability

“Growing digitalization continues to drive demand for semiconductors, as they are indispensable for networking and storage in a wide range of electronic devices, systems and machines. As one of the few European manufacturers of highly integrated industrial memory solutions that produces exclusively in Germany, full control of the production process has always been an integral part of our strategy, as this enables us to guarantee the highest product quality and high delivery reliability,” explains Lars Lust, General Manager APATS (Advanced Packaging, Assembly & Test Solutions) and CEO of Swissbit Germany AG.

Strengthening the market position through increased flexibility

Swissbit has been relying on FUJI placement machines for its in-house production for several years. The company has three SMD placement lines equipped with NXTIII systems and is expanding its performance with the DIE BONDER DB830plus+ from Fasford Technology. Fasford Technology was founded in 1963 as Ome Electronics Kogyousho Co, Ltd, the back-end process group of the semi-conductor division of Hitachi, Ltd. Fasford develops and manufactures DIE bonding equipment and has been a subsidiary of the FUJI CORPORATION Group since 2018.

The NXTIII placement platform from FUJI used at Swissbit is designed for flexible high-mix production. The modular and scalable solution is particularly suitable for the assembly of multi-functional and high-performance electronics with, for example, a high placement density of tiny components and much more. Thanks to its scalability and a high degree of automation, Swissbit can react agilely to market changes.

The newly implemented DIE BONDER DB830plus+ solution is a high-precision DIE bonder with a 2-in-1 concept that supports the stacking of chips with the DAF process and general paste process products. It can be easily switched between direct and parallel operation, enabling flexible production.

“Especially in the rapidly growing semiconductor market, it is crucial to be able to produce quickly and with high quality. By working with FUJI, we can partially automate processes and manufacture with high precision. This gives our production a strong boost,” continues Lars Lust.

FUJI EUROPE CORPORATION at productronica: Automated and flexible assembly

Specialist for placement machines forces productivity increase and a more sustainable future with “R” machine series

Kelsterbach, 21 September 2023 – The electronics industry is in the midst of digital transformation. The sector and production requirements are changing. With its “R YOU READY?” campaign, FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de) is helping companies to solve the challenges posed by this change. In the course of this, the specialist for electronics placement machines is presenting its “R-Series” at “productronica 2023”. These are machines that reduce manual activities to a minimum and are aimed at energy efficiency, flexibility, high-speed and high-precision placement. At the show, FUJI will showcase these and other solutions for automated and flexible placement in Hall A3, Booth 317.

The electronics industry is facing growing challenges. On the one hand, digitization and networking must be driven forward – equipment and systems must be able to communicate seamlessly with each other for end-to-end processes and be integrated into software landscapes. At the same time, market players are facing staff shortages, a lack of raw materials, the energy crisis and fluctuations in demand with rising production costs. Competitive pressure is high.

“Productivity in manufacturing has never been as important as it is today. With our “R” placement machines, we aim for highly efficient and agile production that is also designed for sustainability. Our placement machines of the R-Series support a wide range of production types and prove to be very economical and energy-saving,” says Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH.

At “productronica”, FUJI will demonstrate various automation solutions as well as an electronics production line without human intervention, consisting of the NXTR PM printer and the NXTR A placement machine, with a connection to an AMR (Autonomous Mobile Robot). This allows FUJI to show visitors the interaction of the machines, the heart of the FUJI Smart Factory 2.0, and in the course of this the newly developed RH placement heads, which are used in the R series. The NXTR A automates previously manual processes such as feeder exchange and material replenishment. This frees machine operators from feeder exchange and parts supply tasks, which usually account for the largest share of the operator’s work in front of the placement machines.

Automation and sustainability in placement

The NXTR A and NXTR S placement machines belong to the “R” machine series. They offer a modular design that allows quick adaptations to changing production requirements. Heads, units and even entire modules can be changed without tools. Predictive maintenance is enabled by self-diagnostics that prevent sudden machine stops from affecting the production schedule.

The NXTR models support high-speed panel production, with a high throughput without compromising on quality. The intelligent sensor system ensures stable and high-quality placement. The status of the machine is monitored in real time and the load on components and panels is controlled at the same time.

“In response to market demand, we have released new 2RV modules as part of our NXTR S. The 2RV modules are even faster than the NXTR modules without compromising the transportability of the NXTR modules. The NXTR modules have the largest supported plate size among the NXT machine series. This makes the 2RV modules suitable for a wide range of production, including automotive panels, mobile devices, LED displays and much more,” explains Stefan Janssen.

The third and last in the alliance of the R-series is the new placement solution AIMEXR, which also addresses several central challenges of SMT production: Energy saving, individualization and flexibility as well as speed and efficiency. The solution is designed for uninterrupted operation while reducing energy consumption by around ten percent compared to previous solutions. The AIMEXR can accommodate up to 130 different part types and produce panels up to 1,068 x 610 mm, a very high level of versatility.

In addition, FUJI’s support tool “mobile Conductor” makes it possible to schedule woman and manpower in order to save walking distances. This results in reducing downtime, as operators are informed and can act immediately. Notifications can also be made for non-FUJI equipment.

Automation solutions for the entire process chain

At “productronica”, FUJI will also be showing other solutions and tools that enable fully automated processes. “Our aim is to continuously increase efficiency throughout the entire process chain of placement, while at the same time reducing the environmental impact. With our placement machines, we support, among other things, the optimization and automation of logistics, maintenance and changeover processes. This saves time, effort and ultimately energy,” says Stefan Janssen.

FUJI equipment at YAZAKI: New electric vehicle converter system goes into production

Kelsterbach, 16. August 2023 – Automotive supplier YAZAKI has expanded capacity at its production site in Arad, Romania. For a new production line, YAZAKI Component Technology S.R.L. (YCT) relies on 13 FUJI automatic placement machines, handled by FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). The line includes 3 sFAB-D and 10 NXTR-S to manufacture a bidirectional DCDC converter system for electric vehicles. As a result, the line includes all the equipment required for automotive products and can ensure a high level of throughput and product quality.

YAZAKI Component Technology S.R.L. (YCT) with its production site in Arad is part of YAZAKI Europe Ltd. which is a major member of the YAZAKI Group. Founded in 1941, the globally active company is one of the leading manufacturers of wire harnesses or cable sets. The product range is focused on the automotive and power systems sectors.

Bogdan Baicu, SMT, Soldering & Coating PE Coordinator at YAZAKI Arad explains : “One of our main focuses is on the automotive business. Our latest product is a highly intelligent bidirectional 11-kW OBC-DCDC converter system for electric vehicles, which has the highest protection rating of 6K9K. A new line was required to produce this innovation, which meets the complex technological requirements.”

New line for the production of new converter system

The plant in Arad (Romania) operates 8 SMD lines and is one of three production sites of YAZAKI. The latest line is now equipped with 3 sFAB-D and 10 NXTR-S from FUJI for the production of the new converter system. This converter system for e-vehicles features high integration capability, small size and light weight. It also offers complete protection against dust and splash water entering the system at close range, as well as against high pressure and high temperatures. This demanding product quality must be ideally reproduced in production. The new line therefore has all the equipment required for such automotive products, including MES (Manufacturing Execution System).

“In particular, the NXTR-S smart factory platform offers us unique options that are essential for manufacturing our new product. For example, the pick-and-place machine gives us better board handling, more CPH – components per hour – and greater flexibility in terms of part size, with fewer head types. In addition, we now have a touch-down sensor, line control unit, part inspection and more feeder slots than usual. There is compatibility with existing feeders,” says Bogdan Baicu.

The sFAB-D also supports the high requirements. FUJI’s automated multi-purpose manufacturing machine enables flexible placement of various part sizes, shapes and delivery types of leaded components. It automates THT placement processes that were previously performed manually and ensures stable quality.

Overall, with the new line, YAZAKI achieves the product quality and speed in manufacturing that the e-vehicle market requires today.

Faster (re)action in SMD production: ETB electronic expands placement capacity with FUJI

E²MS-Dienstleister zielt auf höhere Geschwindigkeit und Flexibilität

Kelsterbach, 2. August 2023 – In der Elektronikfertigung sind die Auftragsbücher derzeit vielerorts prall gefüllt. Der E²MS-Spezialist ETB electronic erhöht daher seine Fertigungskapa­zitäten und legt dabei Wert auf Flexibilität. Das bedeutet, das Unternehmen möchte in Zukunft die Fertigung an aktuelle Anforderungen besser anpassen können. Im ersten Investitionsschritt kommen in der 4.000 qm großen Produktionshalle sechs skalierbare Be­stückungsplatt­formen NXTIII zum Einsatz, ein Konzept der FUJI EUROPE CORPO­RATION GmbH (www.fuji-euro.de). Auf ins­gesamt fünf Produktions­linien sollen sukzessive weitere Bestückungsauto­maten von FUJI installiert werden, um eine hocheffiziente und agile Fertigung zu erreichen.

Die 1983 gegründete ETB electronic entwickelt, produziert und montiert technisch anspruchsvolle Elektronik und komplette Geräte. Das Unterneh­men beschäftigt rund 200 Mitarbeitende und hat die Hauptkundschaft in den Be­reichen Industrie, Maschinenbau, Automatisierung, Medizintechnik und Automotive.

Der E²MS-Spezialist strebt eine hochautomatisierte Fertigung an. In der im Jahr 2022 erweiterten Produktionshalle werden Muster, Vorserien und Serien gefertigt. In der SMD-Bestückung kommen bislang auf vier Linien Bestücker eines anderen Anbieters zum Einsatz.

Mit flexibler Technologie schnell an Veränderungen anpassen

Für die Zukunft möchte ETB electronic noch schneller auf neue Kundenbedürfnisse und Nachfrageschwankungen reagieren. Die Linien werden daher vorerst um sechs Bestücker der NXTIII-Serie von FUJI erweitert, woraus sich eine Erhöhung der Ge­samtleistung um rund 60.000 CPH (Components per hour) ergibt. Es sollen suk­zessive weitere Bestückungslösungen von FUJI folgen.

Die Bestückungsautomaten NXT III von FUJI bilden künftig das Herzstück der SMD-Bestückung bei ETB electronic. Damit wird nicht nur die SMT-Bestückungskapazität ausgebaut und die Produktivität erhöht, sondern auch die gebotene Flexibilität erzielt. Die NXT III ist für die flexible High-Mix-Produktion ausgelegt. Die modulare und skalierbare Lösung eignet sich insbesondere für die Bestückung multi­funktionaler und leistungsstarker Elektronik bei beispiels­weise hoher Bestückungs­dichte von winzigen Bauteilen und vielem mehr. Durch die Skalierbarkeit und einen hohen Grad an Auto­mati­sierung kann sich ETB electronic in Zukunft agil auf neue Markt- und Kundenan­forderungen einstellen.

Output tripled with FUJI: R&D Elektronik increases placement output in electronics manufacturing

E²MS service provider expands capacities heading for series production

Kelsterbach, July 27th, 2023 – The demand for high volumes is rising in electronics manufacturing – driven, among other things, by increasing digitization and the associated rise in demand for electrical components. The E²MS service provider R&D Elektronik GmbH & Co. KG, a company of the R&D Group, is adapting to this situation and establishing efficient series production processes. To this end, the company will in future be relying on placement machines from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). With the help of three modules from the AIMEX series, the company was able to more than triple its output.

With almost 50 years of industry experience, the R&D Group is an expert in the field of electronic control technology, electronics and mechanical engineering. As a full-service E²MS provider, R&D Elektronik manufactures and develops electronic products – from prototype to series production. In doing so, R&D Elektronik pays attention to a balanced industry mix of industrial electronics, medical technology, automotive and consumer electronics.

The company already had an placement line in operation for small and medium-sized series production (100 to 1,000 units). The growing demand for high-volume production necessitated an expansion in this area. “The demand for electronic components and devices is increasing across all industries. Electronics are increasingly being used in a wide range of industrial applications. For this reason, we have significantly expanded our production capacities,” explains Theo Schelasni, plant manager at R&D Elektronik GmbH & Co. KG.

Placement in series: positioned for the future

The previous placement line, which is and will remain in operation, produces 35,000 CPH (components per hour). Recently, an additional line was installed, with three modules AIMEX IIIc, FUJI`s flexible high-mix placement machine, producing 75,000 CPH. Thus, the total output could be more than tripled in a very short time. “The FUJI placement machines are running at full speed in our production since the beginning of May 2023. The positive effects were noticeable immediately. We can now also realize larger series production and see ourselves optimally positioned for future challenges,” says Theo Schelasni.

The AIMEX IIIc all-in-one pick-and-place machine supports any type of production and changes in used package shapes. It enables the processing of smallest chip components up to large components. It allows easy ramp-up of new productions or reaction to changes in package shapes. The AIMEX IIIc model can accommodate up to 130 feeders (8mm) on one machine. It can also handle large PCBs with ease. This results in high performance and flexibility – and R&D can respond quickly to changing requirements.