COBO SPA Tackles Growing Product Mix with FUJI’s all-rounder platform AIMEXR

Integrated Systems Manufacturer for the Automotive Sector Reduces Cycle Times with New Placement Machine

Kelsterbach, August 20th, 2025 – COBO SPA manufactures over 70,000 different product variants for industrial and automotive applications – and the number continues to rise. Many of these products, such as dashboards, light switches or headlights, incorporate at least one equipped PCB. To maintain precision and efficiency as volumes grow, the company has upgraded its SMT line. At its headquarters in Leno, Italy, COBO now relies on the all-rounder platform AIMEXR from FUJI. The result: significantly reduced setup and cycle times – even in the face of increasing product diversity.

Founded in 1952, COBO employs more than 1,500 people worldwide and operates eleven manufacturing facilities. The company supplies a broad range of hardware, software, and mechatronics solutions to manufacturers of industrial and specialty vehicles – including those in the construction, agriculture, and logistics sectors – across more than 75 countries. A core part of COBO’s portfolio: complex electronic components such as PCBs for lighting systems, control panels, and ECUs.

“We expect production volumes to continue rising in the coming years. At the same time, product variation is increasing significantly – which puts high demands on our production processes,” says Luigi Massarotto at COBO. “In SMT placement, we need systems that enable fast product changeovers, consistent quality, and high throughput – even for small batch sizes.”

Together with technology partner ALGAR S.p.a. of the FENWICK Group, COBO defined the key requirements for a future-proof SMT environment. Two priorities stood out: drastically reduced setup times and significantly improved equipment availability – both essential for agile and competitive electronics production.

Higher Throughput, Lower Energy Use: New all-rounder platform

Based on this assessment, COBO expanded its existing SMT line with two new FUJI systems – including the AIMEXR all-rounder platform. This marks the first time the AIMEXR has been installed in Europe.

The high-end platform combines newly developed placement heads with integrated real-time sensor technology, enabling high-speed, high-precision component placement.

The new front-end line, made up of the AIMEXR and the AIMEXIII, forms the backbone of COBO’s upgraded electronics production. The new setup is complemented by proven technology solutions for transport, solder paste printing, solder paste inspection (SPI), reflow soldering, and automated optical inspection (3D AOI), along with additional placement machines integrated into the existing line.

“With the AIMEXR, we’ve taken our electronics production to the next level,” says Massarotto. “We need systems that maintain stable takt times and placement quality, even with changing layouts and small lot sizes. The AIMEXR delivers consistent cycle times with remarkable productivity growth, compared to our previous solutions. At the same time, we’ve been able to significantly reduced energy consumption.”

Interview with Stefan Janssen on the occasion of the groundbreaking ceremony for FUJI’s new multifunctional building

Mr. Janssen, today marks the official start of construction on a new multifunctional facility on FUJI’s site in Kelsterbach. What exactly is being built – and why now?

Today is a very special day for us. The groundbreaking is not just the launch of a construction project; it also carries strong symbolic meaning. In economically challenging times for the industry, we are making a conscious statement: we are investing in the future – in our customers, in our European operations, and in our own continued development.

Specifically, we’re building a modern operations facility with approximately 2,370 square meters of additional space. It will combine warehouse capacity, service and repair zones, and modern office and meeting spaces under one roof. This expansion strengthens our infrastructure – not only for the benefit of our local customers, but with an impact that will resonate far beyond the region.


What do you expect to gain from the new facility?

Our objective is clear: we aim to further optimize our supply chain processes and significantly improve our response times to customer demands. In a highly competitive market, this is a key differentiator. The new facility provides exactly the framework we need – with greater flexibility, streamlined workflows, and shorter internal routes.

At the same time, the building is designed with scalability in mind. It lays the foundation for future developments – whether through further growth, new service offerings, or adapting to technological change.


How does this project align with the long-term strategy of FUJI EUROPE CORPORATION?

We believe in Europe – even in challenging times. Our group in Japan and we, as the European subsidiary, are fully aligned and committed to this investment. Europe remains a key market for us, with demanding requirements and significant potential.

With this construction project, we are making a clear commitment to Germany as a location. We want to remain close to our customers, offer short delivery times, provide local service – and do so at a high operational standard. This new facility is therefore a strategic cornerstone for strengthening our long-term presence in Europe.

Were there any major challenges in planning the project? What was particularly important to you in the process?

Projects of this size in Germany are naturally complex – particularly when it comes to permits and bureaucratic procedures. Together with the city of Kelsterbach and our construction partners, we’ve successfully navigated those step by step.

Sustainability was a top priority throughout. We consciously chose a timber construction and are relying entirely on renewable energy sources. Fossil fuels are no longer part of our operations. Instead, modern heat pump systems ensure comfortable indoor climate conditions, the green roof improves energy efficiency, and our expansive photovoltaic system generates more electricity on sunny days than we consume – including the power supply for our steadily growing electric vehicle fleet.

Architecturally, we also placed great importance on continuity: the new building’s design echoes the existing structure and blends harmoniously into the surrounding environment. This is another expression of our long-standing and deep-rooted connection to Kelsterbach.

Investing in the Future: FUJI Builds Multifunctional Facility in Kelsterbach

Groundbreaking Ceremony for New 2,370 m² Facility

Kelsterbach, July 23rd, 2025 – FUJI EUROPE CORPORATION marked the official start of construction on a new extension to its company site in Kelsterbach with a symbolic groundbreaking ceremony. On an additional usable area of approximately 2,370 square meters, FUJI is building a sustainable, multifunctional facility that will house warehouse capacity, modern office and meeting spaces, as well as repair and service areas under one roof.

“Today’s groundbreaking is more than just the beginning of a construction project – it’s a powerful symbol,” says Managing Director Stefan Janssen. “Especially in economically challenging times for our industry, we’re sending a clear message: we are investing in the future – in our customers, in the European market, and in our own continued development.”

The new facility is designed as a multifunctional building that brings together various business functions in one location. In addition to expanded warehousing, it will include areas for repair and service operations as well as modern office and conference rooms.

This investment is aimed at further optimizing the company’s supply chain processes and increasing response speed to customer needs – a crucial factor in a highly competitive market. The new center will enable greater flexibility and streamline workflows. The facility is also designed to be scalable, providing a foundation for future developments – whether through business growth, new service offerings, or technological innovations.

This project aligns seamlessly with the long-term strategy of FUJI EUROPE CORPORATION. “We believe in Europe – even in challenging times. Our parent company in Japan and we as the European subsidiary fully support this investment. Europe remains a core market for us, offering both high expectations and strong potential,” Janssen emphasizes. “This building extension reflects a clear and long-term commitment to Germany as a business location.”

Overcoming Hurdles – with a Focus on Sustainability

As is often the case with large-scale construction projects in Germany, the planning process faced challenges related to permits and regulatory requirements. Thanks to close cooperation with the City of Kelsterbach and construction partners, these were successfully overcome.

Particular attention was given to sustainability: the new facility will operate entirely without fossil fuels. Instead, it will be equipped with modern heat pumps, a green roof, and an extensive photovoltaic system. “On sunny days, our system produces more electricity than we consume – including the energy needed for our steadily growing electric vehicle fleet,” explains Janssen. The building will also be constructed using timber, reinforcing FUJI’s commitment to sustainable resource management.

Architecturally, continuity was key: the design of the new structure mirrors that of the existing building and blends harmoniously into the surrounding urban environment. “It’s an expression of our long-term connection with Kelsterbach,” says Stefan Janssen. The building is scheduled for completion in 2026.

Semitron Increases Production Output by 18 percent with FUJI Placement Machines

Smooth, Low-Maintenance, and Almost Error-Free Placement Processes

Kelsterbach, July 2nd, 2025 – More complex components, higher volumes, and increasing quality requirements – many electronics manufacturers are facing the challenge of adapting their production processes accordingly. At Semitron S.A., the existing placement solutions had become a bottleneck due to their limited feeder capacity, especially with the growing variety of components. By implementing a second SMT line with the FUJI AIMEX IIIc placement machines and the GPX-C solder paste printer, the company increased its daily production output by 18 percent, while simultaneously reducing the defect rate by 15 percent.

Semitron S.A., based in Thessaloniki, Greece, specializes in electronic solutions for the mobility and taxi sectors, the elevator industry, and embedded engineering. The company manufactures taximeters, trackers, elevator controls, display panels, and IoT solutions, among other products. Due to increasing product demand and the need for flexible production processes, modernizing the production line became inevitable. In particular, Semitron required a second SMT line with placement machines capable of handling a wide variety of components while also making the production process more efficient and less error-prone.

“We manufacture a wide range of components. As this variety increased, the limited feeder capacity became a growing problem. At the same time, we had to meet rising demand. Alongside increasing volumes and complexity, we also frequently produce prototypes to continuously improve our products, which requires a high degree of flexibility. Therefore, we needed a versatile placement system that is both reliable and easy to maintain,” explains Mr. Dimitris Vamvatiras, Managing Director at Semitron S.A.

The company ultimately chose two new AIMEX IIIc placement machines from FUJI. Thanks to the machine’s high feeder capacity, Semitron is now able to process a wide variety of components simultaneously.

Dimitris Vamvatiras says: “With the introduction of the FUJI AIMEX IIIc, we increased productivity by 18 percent in a very short time. This increased output did not come at the expense of quality – quite the opposite. We reduced the defect rate by 15 percent.”

The AIMEX IIIc also allows Gerber files to be used in the preparation phase, enabling early detection and correction of errors, misalignments, and polarity issues.

Stencil Printer Further Enhances Production Quality

Production quality is also significantly improved by the FUJI GPX-C stencil printer. This printer ensures the precise application of solder paste and offers a positioning accuracy of ±12 μm (6σ). The FUJI GPX-C enables reliable printing for ultra-fine patterns as well as large-format PCBs. Its flexible clamping system supports a wide range of board types – from thin and warped to large-scale boards. The automated solder paste supply and stencil cleaning functions also significantly reduce maintenance efforts.

“With our investment in a second SMT line with FUJI technology, entirely new possibilities are opening for us in the development and production of innovative electronic solutions. This enables us to handle even more complex and demanding projects,” says Dimitris Vamvatiras.

Bender ramps up automation: FUJI placement solutions boost SMT capacity by 30 percent

Electronics Manufacturer Launches Highly Automated SMT Production in Grünberg

Kelsterbach, June 12th, 2025 – What do an operating room, an EV charging station, and an industrial robot have in common? They all rely on a 100 percent secure power supply. That’s where Bender GmbH & Co. KG comes in. The company develops electronic solutions for safety-critical applications. But with increasing product variety and shrinking batch sizes, alongside growing production volumes, Bender has responded by installing a second fully automated SMT line at its Grünberg site. The new line is based on FUJI EUROPE CORPORATION’s NXTR placement machines and increases Bender’s placement capacity by 30 percent—while maintaining high flexibility even with small batch sizes.

Bender, a family-owned company based in Hesse with a global footprint, produces intelligent and reliable solutions for electrical infrastructure. Its portfolio includes systems for insulation and fault monitoring, energy and charging management, IT solutions, as well as modern HMI and communication technologies. These solutions are used across a wide range of industries – from energy, manufacturing, and e-mobility to medical and critical infrastructure.

“The demands on our production have increased significantly in recent years. We are dealing with rising quantities and greater product variation, while batch sizes are shrinking, and regulatory requirements are tightening – all in the context of a skilled labor shortage and ambitious growth targets. To continue delivering reliably to our customers and future-proof our production, investing in a highly automated SMT line was a logical step,” explains Martin Urban, Head of Production at Bender.

Lower Production Costs and Greater Product Variety

At its Grünberg facility, Bender implemented a fully automated SMT production line featuring state-of-the-art placement solutions from FUJI EUROPE CORPORATION. Among the key components are eight NXTR A modules with Tray Unit RM for precise placement, one NXTR RM, two NXTR S modules, and two sFAB-D systems for THT placement. The latter help standardize formerly manual processes and significantly improve process reliability and efficiency.

“With the new line, we can increase our manufacturing efficiency by approximately 30 percent while remaining agile in response to varying batch sizes and product types. At the same time, we achieve measurably higher product quality. Optimizing resource usage reduces production costs and significantly lowers our environmental footprint -a vital step toward sustainable manufacturing,” adds Martin Urban.

Another milestone is the intelligent networking of all processes along the production line: Autonomous Mobile Robots (AMRs) automatically supply placement machines, printers, X-ray systems, depaneling, and ICT cells. Semi-finished products and unpopulated PCBs are temporarily stored in automated magazine systems. This results in a fully digitized and highly efficient production environment.

Complete System Integration in Record Time – While Production Continued

The project involved establishing a complete SMT manufacturing setup within a year – from incoming goods and board placement to supplying final placement. This required adapting the existing building infrastructure and replacing outdated automation technology. Despite extensive renovations to 15-year-old structures and the relocation of placement areas to different parts of the facility, Bender was able to maintain uninterrupted production and deliveries throughout the process.

“The project began in December 2023 and was completed by November 2024. For us, the new SMT line represents not only a significant increase in capacity but also the creation of redundancy to support our existing operations. Both factors contribute to improved delivery reliability and competitiveness. At the same time, we are now manufacturing our electronic components fully automatically, in top quality, and in compliance with all applicable standards. We are well-prepared for future challenges,” summarizes Martin Urban.

NIVELCO Boosts SMT Throughput with Placement Machines from FUJI

Machine Park Upgraded: Older Systems Relieved, Capacities Expanded

Kelsterbach, May 22nd, 2025 – As machines age, their performance in terms of processing speed, precision, and compatibility with modern manufacturing requirements noticeably declines. This was also the case at NIVELCO PROCESS CONTROL CO., a manufacturer of measurement and automation technology, as the aging placement systems increasingly reached their capacity limits. To relieve these machines and expand production capacity, NIVELCO implemented two AIMEX IIIc placement machines from FUJI EUROPE CORPORATION.

NIVELCO PROCESS CONTROL CO., based in Budapest, specializes in the development and manufacturing of measurement and automation technology for industrial applications. The company serves industries such as electronics, chemicals, and food processing. In order to meet growing market demands and strengthen its competitiveness, NIVELCO invested in modernizing its production.

Switch to FUJI AIMEX IIIc Overcomes Bottlenecks of Legacy Systems

Up until now, NIVELCO relied on two placement machines from a competitor of FUJI, installed in 1999 and 2005. However, with an increasing diversity of components and rising throughput requirements, these machines were gradually pushed to their limits.

“It was important for us to be able to handle more component variants with a single machine, minimize setup times, and increase throughput. That’s why we decided to invest in an AIMEX IIIc from FUJI. With the introduction of the new placement machine, we were able to reduce the load on our existing equipment and significantly increase our production efficiency,” explains Tibor Sári, Production Director at NIVELCO.

The FUJI AIMEX IIIc features up to 130 feeder slots, enabling the processing of a wide variety of components without frequent changeovers. The automatic format change function reduces setup times to just a few minutes, while setup and maintenance requirements are significantly reduced. An integrated Gerber pre-check identifies potential errors, such as polarity or dimensional deviations, during the setup phase.

Thanks to its modular design, the FUJI AIMEX IIIc can be flexibly adapted to different production requirements. Automatic calibration of the placement heads ensures consistently high process reliability, while micrometer-precise placement allows for the accurate processing of even the smallest components.

Second FUJI Placement Machine Quickly Follows the First

Following the successful installation of the first AIMEX IIIc, NIVELCO quickly decided to purchase a second machine of the same type, which was seamlessly integrated into the existing SMT line.

As a result, one of the older machines was taken out of production. “The integration not only increased our production capacity at NIVELCO, but also marks the beginning of a future-ready placement strategy that allows for seamless adaptation to new requirements. In the future, we also plan to replace the other older machine entirely and to purchase a new SMT stencil printer and a reflow oven. Our goal is to further optimize solder paste application and the reflow process,” says Tibor Sári.

Through its collaboration with FUJI, NIVELCO benefits not only from technological advancement but also from a strong local partner network in Eastern Europe. FUJI EUROPE CORPORATION operates a branch in Hungary. The geographical proximity enables fast response times for on-site service and repairs. In addition, a demo center, training facilities, and a spare parts warehouse are available. This allows decision-makers to receive hands-on training, test new technologies, and ensure smooth production processes thanks to quick access to essential spare parts.

Limtronik Solves Increasing Placement Complexity with a New SMD Line from FUJI

Reduced Changeover Times, Increased Quality, and Enhanced Flexibility – Thanks to New Placement Machines

Kelsterbach, February 20th, 2025 – The EMS industry is subject to high volatility due to shorter product life cycles, increasing product variations, and the ongoing miniaturization of electronic components. To meet these challenges with maximum flexibility and scalability, EMS provider Limtronik has expanded its production capacity with a new SMD line. This line is based on NXT III placement systems and additional components by FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). As a result, Limtronik has significantly reduced changeover times, increased quality, and enhanced production flexibility.

Like many other companies in the electronics industry, Limtronik faces high dynamism and increasing complexity in manufacturing. “Electronic devices are becoming smaller, while performance, quality, and functionality continue to increase. The miniaturization of PCB structures and components requires placement accuracy of ±30 µm. At the same time, we need to remain highly flexible—sometimes producing small batches, other times handling large-volume orders,” explains Gerd Ohl, Managing Director of Limtronik GmbH.

With the new SMD line, Limtronik has significantly increased its placement capacity. The line includes six new FUJI NXT III placement machines. “This setup theoretically enables a placement performance of up to 122,500 components per hour. At the same time, there are sufficient feeder slots available to easily handle products with a large variety of components”, says Gerd Ohl.

The NXT III is ideal for placing multifunctional and high-performance electronics, particularly when high-density placement of tiny components is required. The machine features a modular, scalable architecture and supports automated processes. This allows Limtronik to execute projects quickly, even under changing conditions.

Faster Changeovers and Maintenance

With the NXT III, Limtronik has significantly reduced changeover times while increasing maintenance efficiency. Feeders and placement heads can be exchanged quickly and flexibly. Additionally, the intelligent setup concept, featuring guided instructions and automated feeder recognition, ensures an error-free changeover. This allows for quick product transitions—regardless of batch size or assembly complexity.

Maintenance has also been optimized through smart automation solutions. The Smart Nozzle Cleaner efficiently cleans, tests, and stores nozzles (placement pipettes), extending their lifespan and ensuring consistent placement quality. At the same time, nozzle nests for the next product are pre-configured, enabling a fast transition between different jobs. This technology not only enhances placement reliability but also significantly reduces production process times.

Process Control Through Monitoring and Traceability

In addition to the new SMD line, Limtronik operates three other lines with FUJI placement systems, all equipped with powerful monitoring and traceability technology. A barcode scanner identifies incoming PCBs using their 2D codes before they enter the first placement module. This enables product-dependent, automatic program adjustments and process interlocking in case of deviations.

Furthermore, Limtronik utilizes a board-skip feedforward function, which automatically prevents defective PCBs—identified as faulty by the SPI—from being placed. This prevents unnecessary placements, reduces scrap, and saves materials and production time. All collected traceability data can be transmitted to higher-level systems for further analysis.

“Limtronik is a highly experienced electronics manufacturer that leverages the advantages of the NXT concept, particularly regarding the ever-growing demand for flexible setup strategies and changing market requirements. The EMS provider is so well positioned that it can quickly adapt to shifting production volumes while maintaining exceptionally high quality,” explains Sascha Frieling, Manager Technology at FUJI EUROPE CORPORATION.

FEIG ELECTRONIC Significantly Increases Output with FUJI Placement Machines

New SMT Line Achieves Significantly Higher Output with Reduced Space Requirements

Kelsterbach, February 5, 2025 – The demand for higher output volumes is rising, along with the complexity of component geometries – all while manufacturing space remains limited. This situation posed a major challenge for FEIG ELECTRONIC’s electronics production, as the existing SMT line became a bottleneck for growing requirements. By implementing a new SMT line based on the NXTR series placement systems and additional components from FUJI EUROPE CORPORATION GmbH ( www.fuji-euro.de), the company has transformed its SMT production at its Weilburg site, making it future-ready.

FEIG ELECTRONIC GmbH develops and manufactures its own electronic products – from populated PCBs to complete systems – in the product areas of gate and barrier control systems, RFID and barcode systems, and payment terminals. Demand and output continue to increase, but manufacturing space cannot expand accordingly. In addition, the complexity of component geometries is growing in terms of size, shape, and special designs.

“Our previous placement systems required increasing maintenance and could no longer meet the growing demands for efficiency and flexibility. In December 2024, we installed a new SMT placement line with FUJI machines and experienced noticeable positive effects in a very short time. We were able to significantly increase output – while even saving space,” explains Markus Mink, Operations Manager at FEIG ELECTRONIC.

Higher and Automated Placement Performance in a Smaller Space

The new SMT line at FEIG ELECTRONIC consists of six NXTR S placement systems with an automatic tray changer, Smart Nozzle Cleaner, and a NEXIM software package that integrates HERMES and IPC-CFX interfaces for seamless communication.

The increasing number of PCB layers and the higher demands on placement performance required an extension of the reflow soldering system. Stefan Juchem, Regional Sales Manager at FUJI EUROPE CORPORATION, explains: “The additional space required was ideally offset by the compact design of the NXTR modules. These systems are specifically designed to provide very high placement performance while requiring minimal space. This is particularly beneficial in constrained manufacturing environments in brownfield settings.”

FEIG ELECTRONIC is also successfully managing the increasing complexity of components with the NXTR systems. Since the placement heads and nozzles cover a wide range of components, more complex shapes can be placed automatically. As a result, the number of manually placed components in the THT process is reduced.

Reduced Downtime and Higher Production Quality

Markus Mink summarizes: “With the new SMT line, we have significantly increased the efficiency of placement at our Weilburg site. The first few weeks of experience with the FUJI systems have shown not only increased output but also lower rejection rates and fewer errors, which significantly reduces downtime on the line.”

For FEIG ELECTRONIC, the new SMT line is a key element in maintaining competitiveness in this demanding market. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities. Its modular design also provides the foundation for future growth – from efficient production to the already planned expansion of production capacities.

Welcome 2025 – welcome new opportunities!

The management and the entire FUJI team are looking forward to be at your side in 2025 and wish everyone a successful new year. 💪

We have used the holidays to recharge our energy. We want to convert this into innovations over the next few weeks. A small outlook:

💪 New functions for your progress:

We are developing new technologies and features that will make your placement processes even faster, smarter and more sustainable.

🌍 Strengthening the electronics industry together:

We want to further expand our partnerships in the electronics industry. By pooling our strengths with other specialised companies, we gain even more innovative strength together and can develop holistic solutions that help electronics manufacturers to remain competitive and and strengthen Germany as a business location.

💡 Individual Solutions for individual requirements:

Whether highly complex placement processes or individual automation solutions – requirements are becoming increasingly specialised. We therefore rely on highly modular and customised solutions. In this way, we provide you with targeted support achieve your production goals quickly and precisely.

#HappyNewYear #FUJI

Asteelflash Group Significantly Reduces Changeover Times at Bedford Facility with FUJI Solution

EMS Service Provider Adapts to New Market and Customer Demands

Kelsterbach, December 5th, 2024 – The EMS industry requires more flexible, scalable technologies than ever before to manufacture electronics efficiently and quickly respond to new market de-mands. To achieve high agility and performance, Asteelflash Group relies on solutions from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). The EMS provider has expanded its SMT placement capacity at the Bedford facility with eight modules from FUJI’s NXT III placement platform, NEXIM software, and a Smart Setup Station. This investment has allowed Asteelflash to significantly reduce changeover times and increase flexibility in high-mix production.

Asteelflash is a global electronics manufacturing services (EMS) company offering design, development, and manufacturing services for electronic products. It specializes in producing complex electronic systems for various industries. Like many other companies in the electronics industry, Asteelflash is currently facing multiple changes and challenges in the sector, with high pressure from both innovation and competition.

To address these challenges, Asteelflash decided to modernize its SMT production. The company chose FUJI’s modular NXT III placement solution, which is ideal for assembling multifunctional and high-performance electronics. It allows for high placement density of tiny components. Paired with NEXIM software and the Smart Setup Station, the solution helps Asteelflash automate production processes while achieving the highest precision.

Replacing Outdated Equipment for a Competitive Edge

Asteelflash began the phased installation of the FUJI solution at its Bedford facility in January 2023, with the final modules integrated by September 2024. Thanks to the modular and scalable design of the NXT III, production could resume immediately after the first phase of installation. The new platform replaces outdated equipment, whose limited flexibility and long changeover times had significantly impacted production efficiency.

“One of the key requirements was to reduce changeover times in high-mix production to become faster. Thanks to the FUJI solution, we were able to significantly increase speed, expand our SMT placement capacity, and improve our responsiveness to constantly changing market demands. This has provided us with the flexibility that is essential for the current needs of the EMS industry,” said John Cardi, Engineering Manager at Asteelflash Group.