Pursuing next-generation placement technology in the AI era

Kelsterbach, January 20th, 2026 – FUJI CORPORATION (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as “Fuji”) is pleased to announce that it has achieved the world’s first placement of 016008 mm (0.16 x 0.08 mm or 006 x 003 inches) size components on printed circuit boards (PCBs) with its SMT pick and place machine, NXTR, following the successful development of machine technology designed to handle next-generation ultra-small electronic components.

This achievement will be showcased at the 40th NEPCON JAPAN – Electronics R&D and Manufacturing Technology Expo exhibition, January 21, 2026 at Tokyo Big Sight.

There is currently an accelerating shift toward edge AI, where AI processing is performed on the device itself. An era is also emerging in which a wide range of everyday devices, including smartphones, wearable devices, and even medical and healthcare equipment, are autonomously analyze information. Amid these trends toward greater functionality in electronic devices, the number of mounted electronic components is increasing significantly. As a result, further miniaturization and higher-density integration of electronic components have become critical and unavoidable technological challenges.

Even the 0201 mm (0.25 x 0.125 mm, 008004 inches) size component, which has long been considered the smallest standard among currently commercialized electronic components, will eventually reach its limits in the pursuit of higher density to integrate more electronic functions into limited board space. A next-generation component size, 016008 mm (006003″), is being developed in response. 016008 mm (006003″) size components require approximately half of the placement area compared to 0201 mm size components, allowing for higher-density circuit designs.

Four key control technologies enabling the world’s first 016008 mm (006003″) size component placementVier Technologien realisieren die Bestückung von 016008-mm-Bauteilen

FUJI has been providing high-speed, high-accuracy pick and place machines capable of reliably handling very small components. Advancements in the following four key control technologies have made the world’s first placement of 016008 mm (006003″) size components on PCBs possible.

1. Stance recognition during handling
   The orientation and stance of very small components are checked in real time to ensure optimal part handling.
2. Highly-accurate part pickup control
   Deviations in pickup position and the effects of static electricity are addressed for stable part pickup.
3. Super-fine control of placement pressure
   Pressure is precisely controlled to ensure that very small components are not damaged during placement.
4. Ultra-high precision placement positioning control
   With nano-level position compensation, the highest level of placement accuracy in the industry is achieved.

Aiming to build a comprehensive solution for next-generation very small component placement

To place components 016008 mm (006003″) or smaller, it is essential to optimize not only the placement process but also all processes related to placement, including panel design, solder paste materials, stencils, reflow, and inspection, at a high level.

FUJI is developing machine technology for placement robots while deepening cooperation with partners to build a total process solution, including production materials and related materials, taking the race for the miniaturization of electronic components to a new stage as the edge AI era gets fully underway.

Automated, Data-Driven Placement for Zero Placement Errors, Zero Operators, Zero Downtime, and Zero Limits

Kelsterbach, September 9th, 2025 – Zero errors, zero operators, zero downtime, zero limits: At productronica 2025, FUJI EUROPE CORPORATION (www.fuji-euro.de) will demonstrate how this vision can become reality in electronics manufacturing. From November 18 to 21 in Munich, the company will present the “FUJI Smart Factory 2.0” at booth 317 in hall A3 – a modular system for automated, data-driven placement processes.

“Just like in Kyūdō, the Japanese art of archery, electronics manufacturing requires precision, clarity, and utmost focus. Every move, every process step has to hit the target – without detours, without waste. Under the motto ‘No waste, just results. Target Zero.’ we will demonstrate at productronica how intelligent and efficient SMT production is becoming reality,” explains Stefan Janssen, Managing Director of FUJI EUROPE CORPORATION GmbH.

FUJI will demonstrate Smart Factory components for both SMT and THT placement. These are linked in a production line with other manufacturers’ machines via Industry 4.0 M2M communication. Within the so-called “FUJI Smart Factory 2.0” (FSF 2.0), all production-related tasks – starting from material preparation through printing and placement – are intelligently connected. The result: production times reduced by 22 percent.

FSF 2.0 is a concept for a highly intelligent, self-optimizing production environment based on networked, autonomous machines. Its goal: production without errors, downtime, or limitations. At its core is seamless data exchange between machines and integration into a flexible manufacturing system that supports individual requirements, such as one-off production or high product variety.

FUJI’s Target ZERO Strategy in Action

FUJI’s Target ZERO strategy is implemented in the NXTR A model. Its objective: zero placement errors, zero machine operators, zero unplanned downtime, and zero placement limits.

A key element here is the Smart Loader. It automatically retrieves the feeders and nozzles needed for upcoming jobs from Smart Storage. Together with AMRs (Autonomous Mobile Robots), these materials are delivered to the production line on time and without manual intervention. This eliminates time-consuming searching and setup work, while ensuring continuous supply to the line. All setups are automatically positioned at the optimal location for maximum productivity – meaning family setups, clustering, or grouping are no longer necessary. The Smart Loader therefore plays a decisive role in achieving “Zero Operators” and “Zero Downtime” by maintaining a seamless material flow.

“Zero Placement Errors” are enabled by tight SPI/AOI integration, automatic error correction, full board ID traceability, and AI-driven analysis of 5M+E data. Potential defects are detected early and automatically corrected. “Zero Operators” are achieved through automated part provisioning (location management, large part supply units), AMR-supported logistics, and visual setup/operation guidance that minimizes manual input. With predictive maintenance, real-time monitoring of all line components, and mobile alerts via FSF Mobile Conductor, “Zero Downtime” becomes attainable.

“Zero Placement Limits” are not just a matter of higher machine performance. They arise from the combination of modular machines, flexible feeding and supply concepts, and data-driven program and process change mechanisms – for example, program changes triggered by a simple scan code. This allows a much broader range of components and panel variations to be processed per line without compromising precision.

Stefan Janssen adds: “Some Target ZERO effects can already be achieved through individual machine functions or modules. For example, at productronica we will present a new all-in-one placement head for our AIMEXR model – flexible for both high-mix and high-volume production. But FUJI Smart Factory 2.0 is the level where all these technical building blocks come together, multiplying their impact across the entire production line. We are driving our Target ZERO strategy forward by combining automation with AI intelligence.”

Mr. Janssen, today marks the official start of construction on a new multifunctional facility on FUJI’s site in Kelsterbach. What exactly is being built – and why now?

Today is a very special day for us. The groundbreaking is not just the launch of a construction project; it also carries strong symbolic meaning. In economically challenging times for the industry, we are making a conscious statement: we are investing in the future – in our customers, in our European operations, and in our own continued development.

Specifically, we’re building a modern operations facility with approximately 2,370 square meters of additional space. It will combine warehouse capacity, service and repair zones, and modern office and meeting spaces under one roof. This expansion strengthens our infrastructure – not only for the benefit of our local customers, but with an impact that will resonate far beyond the region.

What do you expect to gain from the new facility?

Our objective is clear: we aim to further optimize our supply chain processes and significantly improve our response times to customer demands. In a highly competitive market, this is a key differentiator. The new facility provides exactly the framework we need – with greater flexibility, streamlined workflows, and shorter internal routes.

At the same time, the building is designed with scalability in mind. It lays the foundation for future developments – whether through further growth, new service offerings, or adapting to technological change.

How does this project align with the long-term strategy of FUJI EUROPE CORPORATION?

We believe in Europe – even in challenging times. Our group in Japan and we, as the European subsidiary, are fully aligned and committed to this investment. Europe remains a key market for us, with demanding requirements and significant potential.

With this construction project, we are making a clear commitment to Germany as a location. We want to remain close to our customers, offer short delivery times, provide local service – and do so at a high operational standard. This new facility is therefore a strategic cornerstone for strengthening our long-term presence in Europe.

Were there any major challenges in planning the project? What was particularly important to you in the process?

Projects of this size in Germany are naturally complex – particularly when it comes to permits and bureaucratic procedures. Together with the city of Kelsterbach and our construction partners, we’ve successfully navigated those step by step.

Sustainability was a top priority throughout. We consciously chose a timber construction and are relying entirely on renewable energy sources. Fossil fuels are no longer part of our operations. Instead, modern heat pump systems ensure comfortable indoor climate conditions, the green roof improves energy efficiency, and our expansive photovoltaic system generates more electricity on sunny days than we consume – including the power supply for our steadily growing electric vehicle fleet.

Architecturally, we also placed great importance on continuity: the new building’s design echoes the existing structure and blends harmoniously into the surrounding environment. This is another expression of our long-standing and deep-rooted connection to Kelsterbach.

Smooth, Low-Maintenance, and Almost Error-Free Placement Processes

Kelsterbach, July 2nd, 2025 – More complex components, higher volumes, and increasing quality requirements – many electronics manufacturers are facing the challenge of adapting their production processes accordingly. At Semitron S.A., the existing placement solutions had become a bottleneck due to their limited feeder capacity, especially with the growing variety of components. By implementing a second SMT line with the FUJI AIMEX IIIc placement machines and the GPX-C solder paste printer, the company increased its daily production output by 18 percent, while simultaneously reducing the defect rate by 15 percent.

Semitron S.A., based in Thessaloniki, Greece, specializes in electronic solutions for the mobility and taxi sectors, the elevator industry, and embedded engineering. The company manufactures taximeters, trackers, elevator controls, display panels, and IoT solutions, among other products. Due to increasing product demand and the need for flexible production processes, modernizing the production line became inevitable. In particular, Semitron required a second SMT line with placement machines capable of handling a wide variety of components while also making the production process more efficient and less error-prone.

“We manufacture a wide range of components. As this variety increased, the limited feeder capacity became a growing problem. At the same time, we had to meet rising demand. Alongside increasing volumes and complexity, we also frequently produce prototypes to continuously improve our products, which requires a high degree of flexibility. Therefore, we needed a versatile placement system that is both reliable and easy to maintain,” explains Mr. Dimitris Vamvatiras, Managing Director at Semitron S.A.

The company ultimately chose two new AIMEX IIIc placement machines from FUJI. Thanks to the machine’s high feeder capacity, Semitron is now able to process a wide variety of components simultaneously.

Dimitris Vamvatiras says: “With the introduction of the FUJI AIMEX IIIc, we increased productivity by 18 percent in a very short time. This increased output did not come at the expense of quality – quite the opposite. We reduced the defect rate by 15 percent.”

The AIMEX IIIc also allows Gerber files to be used in the preparation phase, enabling early detection and correction of errors, misalignments, and polarity issues.

Stencil Printer Further Enhances Production Quality

Production quality is also significantly improved by the FUJI GPX-C stencil printer. This printer ensures the precise application of solder paste and offers a positioning accuracy of ±12 μm (6σ). The FUJI GPX-C enables reliable printing for ultra-fine patterns as well as large-format PCBs. Its flexible clamping system supports a wide range of board types – from thin and warped to large-scale boards. The automated solder paste supply and stencil cleaning functions also significantly reduce maintenance efforts.

“With our investment in a second SMT line with FUJI technology, entirely new possibilities are opening for us in the development and production of innovative electronic solutions. This enables us to handle even more complex and demanding projects,” says Dimitris Vamvatiras.

Machine Park Upgraded: Older Systems Relieved, Capacities Expanded

Kelsterbach, May 22nd, 2025 – As machines age, their performance in terms of processing speed, precision, and compatibility with modern manufacturing requirements noticeably declines. This was also the case at NIVELCO PROCESS CONTROL CO., a manufacturer of measurement and automation technology, as the aging placement systems increasingly reached their capacity limits. To relieve these machines and expand production capacity, NIVELCO implemented two AIMEX IIIc placement machines from FUJI EUROPE CORPORATION.

NIVELCO PROCESS CONTROL CO., based in Budapest, specializes in the development and manufacturing of measurement and automation technology for industrial applications. The company serves industries such as electronics, chemicals, and food processing. In order to meet growing market demands and strengthen its competitiveness, NIVELCO invested in modernizing its production.

Switch to FUJI AIMEX IIIc Overcomes Bottlenecks of Legacy Systems

Up until now, NIVELCO relied on two placement machines from a competitor of FUJI, installed in 1999 and 2005. However, with an increasing diversity of components and rising throughput requirements, these machines were gradually pushed to their limits.

“It was important for us to be able to handle more component variants with a single machine, minimize setup times, and increase throughput. That’s why we decided to invest in an AIMEX IIIc from FUJI. With the introduction of the new placement machine, we were able to reduce the load on our existing equipment and significantly increase our production efficiency,” explains Tibor Sári, Production Director at NIVELCO.

The FUJI AIMEX IIIc features up to 130 feeder slots, enabling the processing of a wide variety of components without frequent changeovers. The automatic format change function reduces setup times to just a few minutes, while setup and maintenance requirements are significantly reduced. An integrated Gerber pre-check identifies potential errors, such as polarity or dimensional deviations, during the setup phase.

Thanks to its modular design, the FUJI AIMEX IIIc can be flexibly adapted to different production requirements. Automatic calibration of the placement heads ensures consistently high process reliability, while micrometer-precise placement allows for the accurate processing of even the smallest components.

Second FUJI Placement Machine Quickly Follows the First

Following the successful installation of the first AIMEX IIIc, NIVELCO quickly decided to purchase a second machine of the same type, which was seamlessly integrated into the existing SMT line.

As a result, one of the older machines was taken out of production. “The integration not only increased our production capacity at NIVELCO, but also marks the beginning of a future-ready placement strategy that allows for seamless adaptation to new requirements. In the future, we also plan to replace the other older machine entirely and to purchase a new SMT stencil printer and a reflow oven. Our goal is to further optimize solder paste application and the reflow process,” says Tibor Sári.

Through its collaboration with FUJI, NIVELCO benefits not only from technological advancement but also from a strong local partner network in Eastern Europe. FUJI EUROPE CORPORATION operates a branch in Hungary. The geographical proximity enables fast response times for on-site service and repairs. In addition, a demo center, training facilities, and a spare parts warehouse are available. This allows decision-makers to receive hands-on training, test new technologies, and ensure smooth production processes thanks to quick access to essential spare parts.