Molex ensures positioning accuracy of miniature parts with FUJI NXT series pick-and-place machines

Efficiency and quality in production due to precision in placement as well as simplified maintenance processes of placement heads and nozzles

Kelsterbach, July 21, 2021 – Molex CVS Dabendorf GmbH has decided to use the NXT III placement machine from FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de). With the modular and scalable placement platform, the company, which is specialized in the development and production of electronic components and solutions, achieves high positioning accuracy and efficiency as well as simplified maintenance processes.

Molex’s electronic products are used, for example, in smartphones, household appliances and connected cars. The Molex CVS Dabendorf GmbH branch manufactures components for the automotive industry, among others. The NXT III from FUJI is used at this site for the placement of very small parts as part of the placement process.

“The automotive sector in particular is highly sensitive. The smallest parts used in mass production must have extreme positioning accuracy and high consistent quality. To meet these challenges, we use the NXT III placement machine, the Smart Nozzle Cleaner and the Auto Head Cleaner from FUJI EUROPE CORPORATION,” explains Joost Voskamp, Dabendorf Maintenance Technician at Molex CVS Dabendorf GmbH.

Speed in placement as well as positioning accuracy

The modular and scalable NXT III placement platform is particularly suitable for the placement of multifunctional and highperformance electronics with, for example, high placement density of tiny components and much more. NXT III is designed for high productivity, placement quality, ease of use and speed – and this with very high flexibility due to its modular design. All this makes it very easy to adapt the machine size and configuration to the current requirements. Accordingly, fast XY robots and feeders are used.

Automated head maintenance

FUJI’s original compact, lightweight placement heads can be replaced on the NXT III without tools. On-site operators can perform offline maintenance and troubleshoot problems.

Molex CVS Dabendorf GmbH also uses the Auto Head Cleaner from FUJI. This tool automates and intensifies head maintenance work, where manual execution, especially for the placement heads used for the smallest chip components, cannot keep up with the extended possibilities offered by the Auto Head Cleaner. The use of the Auto Head Cleaner provides a significant quality improvement in head maintenance. It thoroughly removes any dirt that has been gathered in the airways of the heads and also performs a subsequent inspection. The maintenance history and inspection results are automatically stored in the system.

Joost Voskamp explains: “The new maintenance processes for the highperformance placement heads and nozzles enable us to maintain and operate our machines in parallel, so we can keep production running at all times. The machines enable the placement heads and nozzles to be replaced without great effort. We are also impressed by the modularity of the NXT. We can keep the placement output per square meter very high despite the limited space in our production hall. In addition, the system is designed for the future and can be flexibly expanded.”

Simplest nozzle cleaning and inspection

“Regular cleaning of the nozzles is also essential for a smooth process and corresponding placement quality. This is why Molex uses the Smart Nozzle Cleaner from FUJI,” explains Steffen Enderlein, Area Sales Manager at FUJI EUROPE CORPORATION GmbH.

The Smart Nozzle Cleaner not only cleans the nozzles, but also performs an inspection of the nozzle suction surface and a test of the smooth running of the nozzles with springs. Defective nozzles are sorted out separately according to the result. All this is done fully automatically. The operator simply places the nozzle station with the nozzles to be cleaned in the Smart Nozzle Cleaner – complete as removed from the pick-and-place machine without tools – and starts the cleaning program. By using additional nozzle stations, this process takes place offline while the pick-and-place machine is producing.

The maintenance history and inspection results are automatically stored in the system. In addition, the Smart Nozzle Cleaner offers the possibility to store and manage cleaned nozzles inside the unit and also to use them for new setups.

FUJI presents placement solutions with WebExpo for electronic panels of 5G-related devices

Close to the customer despite the pandemic – internationally operating specialist for electronic assembly machines provides virtual information about SMT solutions

Kelsterbach, June 30, 2021 – FUJI EUROPE CORPORATION (www.fuji-euro.de) is currently hosting a WebExpo for customers and interested parties. Users can inform themselves virtually about the products and innovations of the internationally active specialist for electronic placement machines. FUJI is thus breaking new ground in order to be close to the customer even in Corona times and to be able to offer appropriate service. The focus of the WebExpo is on solutions for assembly in the manufacture of devices in the field of 5G technology.

The use of 5G technology is picking up speed worldwide. There are more and more application areas. “Commercial 5G services have started to develop digital infrastructure and deploy digital technologies. This brings new potential in industries. Solutions are rapidly emerging, for example, to support new ways of living for individuals, industries and societies. This concerns, for example, maximizing data usage, automated driving and remote operation of robots. At the same time, part placement of electronic panels of 5G-related devices is becoming increasingly difficult due to higher part density and panel complexity,” explains Stefan Janssen, member of the management board of FUJI EUROPE CORPORATION GmbH.

As a result, FUJI has developed new SMT products for manufacturing the electronic panels used in these advanced devices and is presenting them, as well as smart factory solutions with related automation technology and system integration, during its WebExpo. This online presence will present placement solutions for PCBs used in 5G supporting devices, introductions to the latest products and much more.

Among other things, WebExpo attendees can learn about assembly solutions for SIP and module boards. FUJI will demonstrate the introduction of advanced process solutions for components such as SIP and module parts that support 5G terminals and devices. Among other things, WebExpo attendees can learn about assembly solutions for SIP and module boards. FUJI will demonstrate the introduction of advanced process solutions for components such as SIP and module parts that support 5G terminals and devices. During the WebExpo, FUJI will also present automation and digital twin solutions.

Using product videos, FUJI experts will conduct demonstrations of the equipment units and functions. In addition, the “FUJI Smart Factory Members” will be used to illustrate the introduction of M2M solutions.

Stefan Janssen explains, “It is particularly important to us to be able to act close to the customer and provide appropriate service even during the restrictions of the Corona pandemic. At the same time, we are also looking forward to being physically represented at trade shows again starting in the fall.”

Registration for FUJI WebExpo 2021 at:
https://www.fuji.co.jp/en/about/rs/web_expo_2021_pt/?utm_source=gmnewsletter&utm_medium=email&utm_campaign=gmn_about_rs_web_expo_2021_pt_e_210600

Scalable pick-and-place machines from FUJI reach record number of installations

FUJI sets milestone with 100,000 delivered Modules of the NXT pick-and-place machine series

Kelsterbach, June 14, 2021 – FUJI CORPORATION has recorded 100,000 installed modules of its placement machines series NXT. The multifunctional pick-and-place machine in its latest generation is especially designed for very high speed and positioning accuracy. In Europe, the modules are distributed by FUJI EUROPE CORPORATION (www.fuji-euro.de). In favor of flexibility, modernity and scalability, FUJI’s NXT series is constantly being developed and adapted to all new kinds of production types and technologies.

The market launch of the scalable placement platform took place in 2003 with the first generation of the NXT. In order to meet the constantly changing customer requirements and new technology developments, the NXT is continuously being further developed. In 2008, FUJI reached the next stage of development with the NXT II. In 2013, the company introduced the NXT III, which is particularly designed for productivity, placement quality and user-friendliness, and in 2020 launched the SMT platform NXTR for automated electronics manufacturing.

New record in installations of the modular placement platform

Between 2003 and 2015, 50,000 NXT modules were installed worldwide. By March 2021, FUJI could double the sales figure and thus reach a new milestone. The NXT modules are used in Europe, the USA and on a grand scale in the Asian region, with the majority of the 100,000 installed modules corresponding to the NXT III expansion stage. The NXT series is used in around 60 countries around the globe.

FUJI EUROPE CORPORATION GmbH distributes the NXT series for Europe The specialist for electronic placement machines covers all areas of modern production with its portfolio: from highly flexible placement systems in high-mix to complete placement lines in high-volume.

Klaus Gross, General Manager of FUJI EUROPE CORPORATION GmbH, explains the strong increase in installation numbers, especially in recent years: “Our placement systems of NXT series meet current SMT requirements such as short changeover times and flexibility, but also increasingly automated, digitalized processes. They are thus adapting to the needs of smart factories.”

The NXT III module is particularly in demand in the increasingly digitalized factories. For example, the NXT III is used in the production of mobile devices, wearables, automotive products and server computers. The module also supports processes ranging from prototyping to variable mix and variable volume production.

“In production, the time factor is playing an increasingly important role. Our multifunctional modular pick-and-place machine in third-generation is therefore particularly designed for speed. It supports the smallest parts used in mass production with extreme positioning accuracy. This meets the new requirements on the market,” says Klaus Gross.