Smooth, Low-Maintenance, and Almost Error-Free Placement Processes

Kelsterbach, July 2nd, 2025 – More complex components, higher volumes, and increasing quality requirements – many electronics manufacturers are facing the challenge of adapting their production processes accordingly. At Semitron S.A., the existing placement solutions had become a bottleneck due to their limited feeder capacity, especially with the growing variety of components. By implementing a second SMT line with the FUJI AIMEX IIIc placement machines and the GPX-C solder paste printer, the company increased its daily production output by 18 percent, while simultaneously reducing the defect rate by 15 percent.

Semitron S.A., based in Thessaloniki, Greece, specializes in electronic solutions for the mobility and taxi sectors, the elevator industry, and embedded engineering. The company manufactures taximeters, trackers, elevator controls, display panels, and IoT solutions, among other products. Due to increasing product demand and the need for flexible production processes, modernizing the production line became inevitable. In particular, Semitron required a second SMT line with placement machines capable of handling a wide variety of components while also making the production process more efficient and less error-prone.

“We manufacture a wide range of components. As this variety increased, the limited feeder capacity became a growing problem. At the same time, we had to meet rising demand. Alongside increasing volumes and complexity, we also frequently produce prototypes to continuously improve our products, which requires a high degree of flexibility. Therefore, we needed a versatile placement system that is both reliable and easy to maintain,” explains Mr. Dimitris Vamvatiras, Managing Director at Semitron S.A.

The company ultimately chose two new AIMEX IIIc placement machines from FUJI. Thanks to the machine’s high feeder capacity, Semitron is now able to process a wide variety of components simultaneously.

Dimitris Vamvatiras says: “With the introduction of the FUJI AIMEX IIIc, we increased productivity by 18 percent in a very short time. This increased output did not come at the expense of quality – quite the opposite. We reduced the defect rate by 15 percent.”

The AIMEX IIIc also allows Gerber files to be used in the preparation phase, enabling early detection and correction of errors, misalignments, and polarity issues.

Stencil Printer Further Enhances Production Quality

Production quality is also significantly improved by the FUJI GPX-C stencil printer. This printer ensures the precise application of solder paste and offers a positioning accuracy of ±12 μm (6σ). The FUJI GPX-C enables reliable printing for ultra-fine patterns as well as large-format PCBs. Its flexible clamping system supports a wide range of board types – from thin and warped to large-scale boards. The automated solder paste supply and stencil cleaning functions also significantly reduce maintenance efforts.

“With our investment in a second SMT line with FUJI technology, entirely new possibilities are opening for us in the development and production of innovative electronic solutions. This enables us to handle even more complex and demanding projects,” says Dimitris Vamvatiras.