Throughput in placement more than six-fold – Growth consistently above industry average despite procurement crisis

Kelsterbach, July 25th, 2022 – With the installation of a new production line, EMS service provider Baudisch Electronicwww.baudisch-electronic.de) has raised its SMD production to a new level. The company was experiencing a steady increase in order volume and production was reaching its capacity limits with the previous isolated solution. Baudisch Electronic therefore decided to install an SMD line and realized this with FUJI EUROPE CORPORATION GmbH (www.fuji-euro.de) as general contractor. The throughput of the placement line is six times higher than with the previous solution. Quality and flexibility have been significantly increased by the new line solution.

As a full-service EMS provider with an EMC laboratory, Baudisch specializes in the production of prototypes as well as small and large series. The requirements in this environment are continuously increasing. Individualization, flexibility and speed determine production. For this reason, the new SMD line had to feature a high degree of automation and be capable of placing particularly small components such as 0201 (“008004”) as well as the greatest possible flexibility for odd-form parts up to 74 x 74 mm. Short setup times and lean production were further goals.

Performance improvement all along the line

Today’s SMD line features a transport system, laser, stencil printer, 3D SPI, SMD placement machine, reflow oven and storage system. The six modules of the NXT III placement platform from FUJI EUROPE CORPORATION GmbH form the core. FUJI is a manufacturer of highly flexible placement systems ranging from high-mix/low-volume to complete placement lines in the high-volume market. The company was the general contractor in the project and coordinated all parties involved.

“We have been able to decisively expand our range of services by using the new placement solutions. Our company now handles 01005 components, for example. We can also serve the high-volume sector today. As a result, we address a larger target group and have been able to acquire new customers,” explains Matthias Lenz, Managing Director of Baudisch Electronic GmbH.

At the same time, Baudisch Electronic has increased the placement performance many times in comparison to the previous system. Matthias Lenz sums up: “Already one week after the launch of the new SMD line, the first successes became visible. The output increased from 12,000 BT/h to currently 77,000 BT/h – at a better quality. The higher placement quality also significantly reduced the amount of rework required, and the automatic storage system led to shorter setup times.”

The even more consistent and better product quality results, among other things, from the implementation of the fully automatic SPI system for solder paste inspection, in-line marking by laser and the high-end assembly machines offered by FUJI. At the same time, a new traceability system has been adapted and there is complete traceability of all manufactured products.

Despite crises in the market: constant growth since acquisition of the SMD line

“Since 2020, we have been subject to major challenges due to the Corona pandemic as well as the raw material, energy and chip crises. Nevertheless, Baudisch Electronic’s growth has been consistently above the industry average since the acquisition of the SMD line. This is certainly due to our improved performance. Shorter delivery times, the highest product quality, and a flexible response to changes in orders at short notice – these are arguments that our customers appreciate all the more in these difficult times,” says Matthias Lenz.